At the recent DAC conference in Austin I attended a panel discussion over lunch where engineers from four companies talked about how they approached mixed-signal design and verification challenges for automotive and IoT systems. It seems like 2017 was the year of automotive at DAC, while in 2016 it was all about IoT. Both segments… Read More
A huge theme at #54DAC this year was all things automotive and in particular the phrase ADAS (Assisted Driver Assistance Systems), so I followed up with Raja Tabet a corporate VP of emerging technology at Cadence. We met on Monday in a press room where I quickly learned that Cadence has been serving the automotive industry for the … Read More
This year Cadence Design Systems is showcasing system design enablement in their booth, capitalizing on the industry shift from naked chip design to system level chip design. Apple started it with making the chips inside the iProducts as part of the system and now other systems companies are looking to take more control over their… Read More
If you want to get your finger on the Japan FD-SOI pulse, registration is still open for a free, two-day workshop in Tokyo this week organized by the SOI Consortium. This is the 3rd Annual SOI Tokyo Workshop, and there’s a really interesting line-up of speakers.
In case you’re wondering, Japan is doing FD-SOI. In fact… Read More
Design Data Management (DDM) is a bit like insurance. It’s something every semiconductor company has to have, and as a result it’s probably something taken for granted. In order to make their products more useful, the DDM vendors have added more functionality to manage more of the lifecycle of design data.
Dassault’s Synchronicity… Read More
A long standing tradition has returned to EDA: The CEO Outlook sponsored by ESDA (formerly EDAC) which alone is worth the price of membership! Not only do you get a free meal, the event included quality networking time with the semiconductor elite. In the past, financial analysts moderated this event holding the CEO’s feet to the… Read More
Back in the day the Dracula tool from Cadence was king of the DRC and LVS world for physical IC verification, however more recently we’ve seen Calibre from Mentor Graphics as the leader in this realm. Cadence wanted to reclaim their earlier prominence in physical verification so they had to come out with something different… Read More
The EDA & IP industry enjoys high growth for the Design IP segment, but a detailed analysis tool is missing. IPnest will address this need in 2017, expecting the IP vendors’ contribution! If we consider the results posted last March by the ESD Alliance, the EDA (and IP) industry is doing extremely well, as the global revenue has… Read More
As feature sizes have shrunk, the semiconductor industry has moved from simple, single-exposure lithography solutions to increasingly complex resolution-enhancement techniques and multi-patterning. Where the design on a mask once matched the image that would be produced on the wafer, today the mask and resulting image … Read More
The difficulty of managing the power domains on a complex SoC led to the development of a power format file description, to serve as the repository for data needed for functional and electrical analysis (e.g., CPF, UPF). Yet, what about complex printed circuit boards? How can the power domain information be effectively represented… Read More
