The TSMC OIP Ecosystem Forum is upon us again. I have yet to meet a disappointed attendee so it is definitely worth your time: Networking with more than 1,000 semiconductor professionals, the food, mingling with the 50+ EDA, IP, and Services Companies, the food, and of course the content. The 7nm and 7nm EUV updates alone are worth… Read More
Tag: cadence
Extraction Features for 7nm
Frequent Semiwiki readers are familiar with the importance of close collaboration between the foundries and EDA tool developers, to provide the crucial features required by new process nodes. Perhaps the best illustration of the significance of this collaboration is the technical evolution of layout parasitic extraction.… Read More
Overcoming Mixed-Signal Design and Verification Challenges in Automotive and IoT Systems
At the recent DAC conference in Austin I attended a panel discussion over lunch where engineers from four companies talked about how they approached mixed-signal design and verification challenges for automotive and IoT systems. It seems like 2017 was the year of automotive at DAC, while in 2016 it was all about IoT. Both segments… Read More
ADAS and Vision from Cadence
A huge theme at #54DAC this year was all things automotive and in particular the phrase ADAS (Assisted Driver Assistance Systems), so I followed up with Raja Tabet a corporate VP of emerging technology at Cadence. We met on Monday in a press room where I quickly learned that Cadence has been serving the automotive industry for the … Read More
Cadence Design Systems @ #54DAC!
This year Cadence Design Systems is showcasing system design enablement in their booth, capitalizing on the industry shift from naked chip design to system level chip design. Apple started it with making the chips inside the iProducts as part of the system and now other systems companies are looking to take more control over their… Read More
FD-SOI in Japan?
If you want to get your finger on the Japan FD-SOI pulse, registration is still open for a free, two-day workshop in Tokyo this week organized by the SOI Consortium. This is the 3rd Annual SOI Tokyo Workshop, and there’s a really interesting line-up of speakers.
In case you’re wondering, Japan is doing FD-SOI. In fact… Read More
Webinar: Next Generation Design Data & Release Management
Design Data Management (DDM) is a bit like insurance. It’s something every semiconductor company has to have, and as a result it’s probably something taken for granted. In order to make their products more useful, the DDM vendors have added more functionality to manage more of the lifecycle of design data.
Dassault’s Synchronicity… Read More
EDA CEO Outlook 2017
A long standing tradition has returned to EDA: The CEO Outlook sponsored by ESDA (formerly EDAC) which alone is worth the price of membership! Not only do you get a free meal, the event included quality networking time with the semiconductor elite. In the past, financial analysts moderated this event holding the CEO’s feet to the… Read More
A New Product for DRC and LVS that Lives in the Cloud
Back in the day the Dracula tool from Cadence was king of the DRC and LVS world for physical IC verification, however more recently we’ve seen Calibre from Mentor Graphics as the leader in this realm. Cadence wanted to reclaim their earlier prominence in physical verification so they had to come out with something different… Read More
IP Vendors: Call for Contribution to the Design IP Report!
The EDA & IP industry enjoys high growth for the Design IP segment, but a detailed analysis tool is missing. IPnest will address this need in 2017, expecting the IP vendors’ contribution! If we consider the results posted last March by the ESD Alliance, the EDA (and IP) industry is doing extremely well, as the global revenue has… Read More