The demand for high-performance computing (HPC), data centers, and AI-driven applications has fueled the rise of 2.5D and 3D multi-die designs, offering superior performance, power efficiency, and packaging density. However, these benefits come with myriads of challenges, such as multi-physics, which need to be addressed.… Read More
Electric Machine Innovation Conference 2025
Empowering Engineers to Electric Machine Design
This in-person technical conference will focus on the latest technological advancements in electric machine development. A range of speakers from the industry will discuss their challenges and approaches in this area. In the presentations and workshops, you will learn about… Read More