Nonvolatile memory capacity reached 64 Gb levels when NAND Flash half-pitch reached 20 nm [1]. Having reached 14 nm [2], NAND Flash half-pitch is no longer being reduced, now that it has entered the 3D era. However, recently, 3D XPoint has found applications within the Optane platform [3]. The lithography for patterning 20 nm half-pitch… Read More
The overwhelming majority of transistors produced in the world are used in memory cells, either as the memory itself (Flash, SRAM), or as the access device (DRAM). Yet, it is not necessary to have a transistor in every memory cell. In 2015, 3D XPoint, the first major product based on transistor-less memory cells, was announced [1].
Non-volatile memory (NVM) is finding new roles in datacenters, not currently so much in “cold storage” as a replacement for hard disk drives, but definitely in “warm storage”. Warm storage applications target an increasing number of functions requiring access to databases with much lower latency than is possible through paths… Read More
On the Sunday evening at IEDM last year, TechInsights held a reception in which Arabinda Das and Jeongdong Choe gave presentations that attracted a roomful of conference attendees.
This is the second part of the review of Jeongdong’s talk, we covered NAND flash technology in the last post. Jeongdong is a Senior Technical… Read More
Micron put up a great quarter beating both quarterly expectations and guidance. Even though the stock was up 8% and we still think it has a long way to go as investors have not fully embraced the upside ahead in the memory market.… Read More
The 2016 edition of the Flash Memory Summit produced more than the usual amount of excitement. Samsung’s response to the Intel/Micron 3D XPoint challenge arrived in new slideware, indicating the war for next-generation SSDs is just starting. Who has the advantage?
We’d all like to think this is about creating a breakthrough technology,… Read More
Intel has been the focus of a lot of attention in the last week due to the company’s major restructuring announcement which came on the heels of Intel’s most recent earnings announcement. The majority of analyses that immediately followed the company’s announcement focused singularly on the layoffs, which amount to 11% of the … Read More
Recently Intel and Micron announced a new three dimensional cross point (3D Xpoint) memory. The 3D Xpoint announcement has generated a lot of questions and interest in what this new memory is and where it may fit in the semiconductor market. … Read More
