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  1. D

    Mate60 pro Finfet TEM

    Definitely SEM
  2. D

    Mate60 pro Finfet TEM

    Correct, it is residual STI between N & P regions. BTW it is a SEM image not a TEM image.
  3. D

    Ultra Pure Silicon to Open new frontier in chips?

    Quite a few years ago there were claims that 28Si would enhance transistor performance, but it never became commercial; this looks like a viable way to create improved quantum devices, but I would be surprised to see it spread beyond those. Given the super purity of semiconductor silicon, I...
  4. D

    New Disruptive Microchip Technology and The Secret Plan of Intel by Anastasi in Tech

    I would add in CMP at IBM… and tungsten plugs… that’s going back to the ’80s🙂 Before that we were limited to three or four metal layers, and that was a push.
  5. D

    Japan's Rapidus beckons global semiconductor talents, TSMC must prevent brain drain

    To me IBM 2nm is still a step ahead of the commercial NS processes shown so far, since it has the isolation layer under the bottom gate.
  6. D

    Japan's Rapidus beckons global semiconductor talents, TSMC must prevent brain drain

    More likely the nanosheet process https://research.ibm.com/blog/2-nm-chip
  7. D

    Apple’s New M1 Ultra Packs a Revolutionary GPU

    If two dies use a CoWoS interposer, it would have to be two-exposure; more likely that they use a silicon bridge, INFO_LSI/CoWoS-L. https://www.techinsights.com/blog/apple-joins-3d-fabric-portfolio-m1-ultra
  8. D

    Intel moves EUV litho track and scanner from Oregon to Ireland

    Agreed - how far is Intel down the delivery list?
  9. D

    Intel moves EUV litho track and scanner from Oregon to Ireland

    Could it be to give the guys in Leixlip a year or two running EUV before the production systems are installed?
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