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Samtec Increases Signal Density Again with Analog Over Array™

Samtec Increases Signal Density Again with Analog Over Array™
by Mike Gianfagna on 10-04-2023 at 6:00 am

Samtec Increases Signal Density Again with Analog Over Array™

Samtec is well-known for its innovative signal channel solutions. Whether the application requires copper or fiber, Samtec can deliver incredible performance and flexibility. The quality of the company’s models, eval kits and design support are well-known. There is another aspect of Samtec’s innovation. I touched on it in last month’s post when I discussed how Samtec can turn bulky waveguides into flexible cables. Beyond performance, this approach has a big impact on form factor and signal density – two very important topics these days. In this post, I’ll explore another innovation from Samtec that mixes analog and digital signals in the same connection. Read on to see how Samtec increases signal density again with Analog Over Array™.

What is Analog Over Array?

Samtec Analog Over Array connectors are dense, high-frequency connectors supporting digital and analog differential or single-ended signaling. An open pin field design is used that provides the flexibility to simultaneously run differential pairs, single-ended signals, and power through the same interconnect. The figure at top of the post shows what these connectors look like.

Samtec’s high-density array connectors are already proven in high-speed, high-performance digital applications. For RF applications, Samtec adds industry-leading differential crosstalk and return loss performance beyond 8 GHz. You get performance and a denser form factor in once package.

Features of the technology include:

  • Open-pin-field design with maximum routing and grounding flexibility
  • Analog and digital signals (differential pairs and/or single-ended) plus power though the same interconnect
  • Differential ground pattern supports RF SOCs
  • Single-ended ground pattern

The approach can be used in a wide range of applications, including 5G/LTE, remote PHY, phased digital/array radar, test and measurement, low/medium Earth orbit satellites, and RF SoCs. If you are working in any of these areas, you should check out what Analog Over Array can do for your project.

There are more details and references coming, but here is a top-level summary of performance:

  • 50 Ohm system impedance (single-ended); 100 Ohm system impedance (differential)
  • Return loss (maximum): -12 dB up to 4 GHz; -10 dB up to 8 GHz
  • Crosstalk isolation between channels (minimum): -69 dBc to 4 GHz; -53 dBc to 8 GHz

How Can I Get It?

Analog Over Array capability is available through several Samtec products:

NOVARAY® 112 GBPS PAM4 ARRAY, EXTREME DENSITY ARRAYS

NOVARAY® 112 GBPS PAM4 ARRAY, EXTREME DENSITY ARRAYSFeatures

  • 112 Gbps PAM4 per channel
  • 0 Tbps aggregate data rate – 9 IEEE 400G channels
  • PCIe® 6.0 capable
  • Innovative, fully shielded differential pair design enables extremely low crosstalk (beyond 40 GHz) and tight impedance control
  • Two points of contact ensure a more reliable connection
  • 92 Ω solution addresses both 85 Ω and 100 Ω applications
  • Analog Over Array™ capable

ACCELERATE® HP HIGH-PERFORMANCE ARRAYS

Features

  • 635 mm pitch open-pin-field array
  • 56 Gbps NRZ/112 Gbps PAM4 performance
  • Cost optimized solution
  • Low-profile 5 mm and up to 10 mm stack heights
  • Up to 400 total pins available; roadmap to 1,000+ pins
  • Data rate compatible with PCIe® 6.0 and 100 GbE
  • Analog Over Array™ capable

SEARAY™ 0.80 MM PITCH ULTRA HIGH-DENSITY ARRAYS

SEARAY™ 0.80 MM PITCH ULTRA HIGH DENSITY ARRAYSFeatures

  • 80 mm (.0315″) pitch grid
  • 50% board space savings versus .050″ (1.27 mm) pitch arrays
  • 28 Gbps NRZ/56 Gbps PAM4 performance
  • Rugged Edge Rate® contact system
  • Up to 500 I/Os
  • 7 mm and 10 mm stack heights
  • Solder charge terminations for ease of processing
  • Samtec 28+ Gbps Solution
  • Final Inch® certified for Break Out Region trace routing recommendations
  • Analog Over Array™ capable

LP ARRAY™ LOW PROFILE OPEN-PIN-FIELD HIGH-DENSITY ARRAY

Features

  • 4 mm, 4.5 mm, 5 mm stack heights
  • Up to 400 I/Os
  • 4, 6 and 8 row designs
  • .050″ (1.27 mm) pitch
  • Dual beam contact system
  • Solder crimp termination for ease of processing
  • 28 Gbps NRZ/56 Gbps PAM4 performance
  • Analog Over Array™ capable

To Learn More

Samtec will soon offer complete evaluation kits to test-drive Array Over Analog technology. Stay posted for details about these kits here.  A detailed characterization report on a SEARAY design is available here.  Other Samtec product families mentioned in the article are on the roadmap.  A White Paper on the technology is available here.  And that’s how Samtec increases signal density again with Analog Over Array™.

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