In Part 1, we reviewed four of the highlights of the recent TSMC Technology Symposium in San Jose. This article details the “Final Four” key takeaways from the TSMC presentations, and includes a few comments about the advanced technology research that TSMC is conducting.… Read More
Key Takeaways from the TSMC Technology Symposium Part 1
TSMC recently held their annual Technology Symposium in San Jose, a full-day event with a detailed review of their semiconductor process and packaging technology roadmap, and (risk and high-volume manufacturing) production schedules.… Read More
Can Qualcomm avoid repeating Motorola’s fate?
NPR had an interesting guest this morning: Edward Luce, author of “Time to Start Thinking: America in the Age of Descent”. I’m not about to turn SemiWiki into a politics blog, but there is some precedent in the technology business. I’ve caught myself saying more than once recently that “Motorola is no longer the company I worked 14… Read More
TSMC and ARM Serving up 7nm!
One thing I learned while writing the books about TSMC and ARM is that collaboration has always been at the core of both companies. They started with collaboration on day one and it is now a natural part of their business models. And the word collaboration in the fabless semiconductor ecosystem gets redefined at every process node,… Read More
SPIE – Interview with Greg Mcintyre of IMEC
One of the things I really like about major technical conferences is the opportunity to meet with people for networking and interviews. On Wednesday at the Advanced Lithography Conference I had the opportunity to interview Greg Mcinttyre, the director of advanced patterning at IMEC.
IMEC researchers are the first author on 32… Read More
Intel Adds ‘Authenticate’ Multi-Factor Security Feature
Last summer, Intel launched their 14nm, 6th Generation Core processors, code-named ‘Skylake’, alongside Microsoft’s new Windows 10 operating system. As things usually go in the enterprise world, the commercial 6th Generation of Intel’s Core vPro processors weren’t too far behind with increased security and manageability… Read More
Intel EUV Photoresist Progress and ASML High NA EUV
SPIE Days 3 and 4:
Anna Lio of Intel presented EUV resists: What’s next?
Intel wants to insert EUV at 7nm but it has to be ready and economical. Critical Dimension Uniformity (CDU), Line Width Roughness (LWR) and edge placement/stochastics are all stable on 22nm, 14nm and 10nm pilot lines.… Read More
TSMC 2016 Technology Symposium and Apple SoCs!
It is that time again, time for the originators of the pure-play foundry business to update their top customers and partners on the latest process technology developments and schedules. More specifically, all of the TSMC FinFET processes (16nm, 10nm, 7nm, and beyond), TSMC IP portfolio (CMOS image sensor, Embedded Flash, Power… Read More
How China can Lead in the Semiconductor Industry
Since a few years China has been very aggressive in acquiring semiconductor companies around the world. Last year, Chinese government along with PE (Private Equity) and other investors in China announced an ambitious plan under which more than $150 billion were to be invested over next 5 to 10 years in developing semiconductor… Read More
My Last Day at Fairchild
Well today is the day. I am officially retired from Fairchild after 36 years and 9 months on the job. I have worked for Fairchild Camera and Instrument, Fairchild a Schlumberger Company, National Semiconductor and Fairchild Semiconductor. It’s been everything I was hoping for and more. By the way, I walked out the front door… Read More
Bluetooth 6.0 Channel Sounding is Here