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Hello! The most important semiconductor company in the world reported earnings last night. It’s been something of a tradition to post Taiwan Semiconductor Company (TSMC) earnings posts not behind my paywall, and I think that I’m going to continue that to kickoff each earnings season.
There are so many threads in the TSMC call that… Read More
-Chips for America is better than nothing, but not much
–TSMC $40-44B Capex crushes competition (Intel & Samsung)
-Additional efforts other than handouts are necessary
-Could/should TSMC be “adopted” as a US company?
Competition can’t keep up with $40-$44B of Capex
TSMC’s recent announcement… Read More
The further scaling of interconnect and via lithography for advanced nodes is challenged by the requirement to provide a process window that supports post-patterning critical dimension variations and mask overlay tolerances. At the recent international Electron Devices Meeting (IEDM) in San Francisco, TSMC presented … Read More
Previous SemiWiki articles have described the evolution of embedded non-volatile memory (eNVM) IP from (charge-based) eFlash technology to alternative (resistive) bitcell devices. (link, link)
The applications for eNVM are vast, and growing. For example, microcontrollers (MCUs) integrate non-volatile memory for … Read More
Advanced 2.5D/3D Packaging Roadmapby Tom Dillinger on 01-03-2022 at 6:00 amCategories: Events, Foundries, TSMC
Frequent SemiWiki readers are no doubt familiar with the advances in packaging technology introduced over the past decade. At the recent International Electron Devices Meeting (IEDM) in San Francisco, TSMC gave an insightful presentation sharing their vision for packaging roadmap goals and challenges, to address the growing… Read More
Standard Cell Scaling
Complex logic designs are built up from standard cells, in order to continue to scale logic we need to continually shrink the size of standard cells.
Figure 1 illustrates the dimensions of a standard cell.
Figure 1. Standard Cell Dimensions.
From figure 1 we can see that shrinking standard cell sizes requires… Read More
System on chip (SoC) based design has long been recognized as a powerful method to offer product differentiation through higher performance and expanded functionality. Yet, it comes with a number of limitations, such as high cost of development. Also, SoCs are monolithic, which can inhibit rapid adaptation in the face of changing… Read More
No matter how impressive the specifications are for an SoC, the power performance and area of the finished design all depend on the IP selected for the IO blocks. In particular, most SOCs designed for consumer and enterprise applications rely heavily on PCI Express. Because PCIe analog IP is critical to design success, Samsung … Read More
TSMC drew the ire of Chinese state media last week after it complied with the US Department of Commerce request to submit supply chain data by the November 8 deadline.
The Chinese reports, which called it an act of “surrender” to US hegemony, were careful in laying blame on Taipei for caving in to Washington, rather than pointing fingers… Read More
This is an interesting piece of TSMC history. From 1987 to 1988 James E. Dykes served as the first President and Chief Executive Officer of Taiwan Semiconductor Manufacturing Company Ltd.
Taiwan Semiconductor Outlook
by James E. Dykes
President & Chief Executive Officer
Taiwan Semiconductor Manufacturing Company
Given… Read More
Flynn Was Right: How a 2003 Warning Foretold Today’s Architectural Pivot