How Samtec Blazes a Trail to 224/448 Gbps at DesignCon 26I recently covered what Samtec was doing at…Read More
Available Is Not In Control: Balancing Output, Quality, and Risk in High-Volume FabsA deposition chamber drops out of production at…Read More
AION Silicon: Architecting Smarter SoCs with RISC-V: Balancing Performance, Flexibility, and Risk Architecting Smarter SoCs with…Read More
AI-native Virtual Chiplet Eco-systems: Shift Left, Shift Up, and Shift Out to accelerate Chiplet adoptionSystems-in-package (SIPs) with 2.5D and 3D heterogenous integration,…Read More
The Yield Partnership: Intel and PDF Solutions Tackle Advanced NodesOne of the most difficult things to do…Read More
As a semiconductor professional and an Apple customer I’m very interested to see what is inside the iPhone5s. Rumors are spreading, photos are leaking, creating a nice build up to the next release of the mobile device that changed the world.
Honestly, last year I was a bit disappointed with the iPhone5. Inside is the A6 SoC which uses… Read More
I first met Michael Munseyback at Viewlogic in the 1990’s, so was pleased to meet with him at DACand get an update on what Dassault Systemes has to offer the EDA world.
Michael Munsey, Dassault Systemes
With EDA tool development in San Jose, Beijing and China, ProPlusis probably best known for their device modeling software called BSIMProPlus. At DAC I met with Lianfeng Yang, Ph.D. the VP of Marketing to hear about what’s new.
Lianfeng Yeng, ProPlus
… Read More
I’m keenly interested in SPICE circuit simulators, so at DACI met with John Piercefrom Cadence to get an update on what’s new this year.
John Pierce, Cadence
… Read More
You are probably aware that Imagination Technologies, perhaps most well known for creating the GPU that is in the iPhone and iPad, acquired MIPS, which was originally a spinout from Silicon Graphics and licenses a line of general purpose microprocessors.
MIPS considers that they have a purer implementation of the RISC philosophy… Read More
Production of electronic equipment (including computers, communications, consumer, etc.) has been sluggish over the last year in all key regions of the world except China. The chart below shows three-month-average change versus a year ago for electronics production in local currency through April 2013 (May 2013 for China).… Read More
Kathryn Kranen, CEO of Jasper Design Automation, got to give her view of the future of EDA on the Thursday of DAC. For many years she has been on the EDAC board and is currently chair. When she first was on the board she talked to many of the stakeholders in the EDA ecosystem: EDA companies, IP companies, semiconductor companies, academics,… Read More
We must admit the excitement of the FinFETs and all that coupled with the enormous amount of DSPs and BRAMs in the FPGA world is very cool. They even have ARMs, and I highly recommend that they get Legs then they can run around and everything and fit in with the rest of us. Perhaps the Feds can grant them immigration status and they could… Read More
If you’re involved with AMS or transistor-level IC design then having visual tools will help you design and debug quicker. At DAC I met with Gerhard Angst, President and Founder of Concept Engineering to get an update.
Gerhard Angst (center), Concept Engineering… Read More
ASIC prototyping from multiple vendors using FPGA boards was popular at DAC again this year in Austin, Texas. I stopped by the Tektronix booth for a few minutes to meet with Dave Orecchio to get an update.
Dave Orecchio (right), Tektronix… Read More
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Intel 18A vs Intel 18A-P: What Is the Difference and Why Does It Matter?