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By Jeff Wilson, Mentor Graphics
We’ve talked about the new requirements for Fill in IC design for advanced nodes in previous blogs on this site. This time I’d like describe the fill solution that Mentor and TSMC have jointly developed to meet the requirements of fill for TSMC’s 20nm (N20) manufacturing process.
The traditional… Read More
The annual GSA Silicon Summit is coming up in a few weeks. It is on April 10th at the Computer History Museum. Registration is at 9am and the meeting itself gets started at 9.45am. The summit finishes at 2.15pm. There are three sections during the day, and lunch is provided.
The first section is on Advancements in Nanoscale Manufacturing… Read More
Can we agree about the fact that the Moore’s law is discontinuing after 28nm technology node? This does not mean that the development of new Silicon technology, like 14nm or beyond, or/and new Transistor architecture like FinFET will not happen. There will be a market demand for chips developed on such advanced technologies: mobile… Read More
In this age of SoCs with hundreds of IPs from different sources integrated together and working at high operating frequencies, FPGA designers are hard pressed keeping up the chip reliability from issues arising out of excessive static & dynamic IR drop, power & ground noise, electro migration and so on. While the IPs are… Read More
Cadence continues on its quest to be a top semiconductor IP supplier which is a good thing since the semiconductor world now revolves around IP. Cadence CEO Lip-Bu Tan mentioned IP 14 times during his keynote and he was followed by the president of Imagination Technologies and the CEO of recently acquired Tensilica. I was not afforded… Read More
For the connected, in the instant knowledge, information world we live in, the missing Malaysia Airlines Flight 370 is most humbling. Let us be reminded as we look for details, and theorize… that someone’s Father, Mother, Brother, Sister, Son, Daughter, Friend are missing. Just terrible but the Miller’s continue to pray and hope… Read More
3D TV has been all the rage over the past few years because of the added realism it offers the viewer, but there’s really not that much content that you can stream or play on a Blu-ray device. Wouldn’t it be cool if there was a box that could create 3D on the fly from a 2D stream or Blu-ray? This week I discovered that such a box… Read More
The Jasper European User Group meeting (EJUG) is coming up in a couple of weeks. It will be held in the Munich Hilton (which I have stayed in many times, the S-bahn from the airport pretty much stops in the basement) on April 2nd.
The schedule for the day is:
9:00 AM – Registration and continental breakfast
9:30 AM – Jasper… Read More
The biggest market for semiconductors is mobile and an ARM processor is the center of the axle around which it revolves. So everyone in the mobile ecosystem needs to work closely with ARM. At CDNLive earlier this week Cadence and ARM announced that they are deepening their partnership. Most of what they announced makes it a lot easier… Read More
Wearables are going to be a real game changer for the fabless semiconductor ecosystem, absolutely. What other high volume semiconductor market segment has such a low barrier of entry? Speaking of low barrier of entry, the first stop on my Southern California trip last week was Monrovia, the home of Tanner EDA. Tanner is already … Read More
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The $725 Million Chip Development: Why Execution Risk, Not IP Cost, Now Dictates Advanced-Node Survival