Why making the difference between chips and cores, when mentioning that CEVA’s customers have shipped four billion IC to date? Because that can make a big difference! Imagine for example an IP vendor selling processor IP cores to be used in massively parallel computing application, when the chip maker create a processor NxM matrix,… Read More





CDNLive Call For Papers
The Silicon Valley CDNLive, the Cadence user conference, will be on March 12-13th 2013 in Santa Clara. But the heart of CDNLive are customer presentations and the call for papers is now open. The deadline is December 4th (at 5pm PST for people who really like to come down to the wire). At this point only an abstract is required.
There… Read More
2nd International RRAM Workshop at Stanford
The 2nd International Workshop on Resistive RAM. The workshop was the second installment of an annual series organized by Stanford University and the Belgian research institute Imec. Like most RRAM workshops, this year’s event featured talks focusing on the physics of RRAM devices and their underlying switching mechanism(s).… Read More
The Auto Industry Speaks @ Renesas DevCon
This year’s Renesas DevCon in Orange County, CA kicked off yesterday with an impressive lineup of speakers, record attendance, and an increased focus on automotive.
“TheAuto Industry Speaks,” an Expert Panel organized by Martin Bakerof Renesas, featured:
- Yoichi Yano, RenesasExecutive VP and Member of the Board, who early
Power and Reliability Challenges
Last week I attended the Ansys/Apache seminars on “Dimensions of Electronic Design.” The two big challenges as we go down to 28nm and 20nm and below are keeping power manageable and keeping reliability up.
The big challenge with power is that we can put so much stuff on a die and clock it so fast that the power is exceeding… Read More
Learning about MEMS in Israel from: EDA companies, Foundry, University, Users
In April I attended and blogged about a webinar on MEMS and IC co-design hosted by two EDA companies: SoftMEMS and Tanner EDA. On October 30th you can attend a full-day event in Israel that is more comprehensive than the webinar that I attended.… Read More
Google Datacenter
In my blog about Intel’s latest results I linked to an interesting article in Wired about Google’s datacenters.
I happened to be browsing some websites in the Netherlands (actually I don’t speak a word of Dutch, a Dutch friend pointed it out to me) and there is an article showing how the pictures that accompany… Read More
Hybrids on BeO then, 3D-IC in silicon now
Once upon a time (since every good story begins that way), I worked on 10kg, 70 mm diameter things that leapt out of tubes and chased after airplanes and helicopters. The electronics for these things were fairly marvelous, in the days when surface mount technology was in its infancy and having reliability problems in some situations.… Read More
Why Blog on SemiWiki.com?
The Semiconductor Wiki Project, the premier semiconductor collaboration site, is a growing online community of professionals involved with the semiconductor design and manufacturing ecosystem. Since going online January 1st, 2011 more than 400,000 unique visitors have landed at www.SemiWiki.com viewing more than 3M pages… Read More
TSMC OIP Forum 2012 Trip Report!
The second annual TSMC Open Integration Platform Ecosystem Forum was last week and let me tell you it was excellent. Great update on the TSMC process technology road maps, great for networking within the fabless semiconductor ecosystem, great for seeing what’s new in EDA and IP, and great for SemiWiki. It was time well spent for … Read More
Unlocking the cloud: A new era for post-tapeout flow for semiconductor manufacturing