Accellera 2024 End of Year UpdateFrom my viewpoint, standards organizations in semiconductor design…Read More
Synopsys Brings Multi-Die Integration Closer with its 3DIO IP Solution and 3DIC ToolsThere is ample evidence that technologies such as…Read More
Enhancing System Reliability with Digital Twins and Silicon Lifecycle Management (SLM)As industries become more reliant on advanced technologies,…Read More
Aveek Sarkar presented a webinar on chip-package-system (CPS) earlier this summer. One of the big challenges with low-power electronic systems is that the performance, power and price goals are mutually conflicting. It’s like the old joke about “pick any 2”. But for a real system all need to be optimized. … Read More
There are three articles on the front page, in the September release of Cadence newsletter, all of them are dedicated to either IP (DDR4), VIP (NVM express VIP being used at Samsung) or Martin Lund. You can read Martin’s interview here and/or take a look at what I write about him this summer. This strong focus on IP, and in fact on Interface… Read More
In response to changing industry dynamics, AMD announced in October 2008 a new strategy to focus exclusively on the design phase of semiconductor product development. To achieve that strategy, AMD partnered with Advanced Technology Investment Company (ATIC) of Abu Dhabi to create a new joint venture company designed to become… Read More
Ever since Intel announced that they will leverage their advanced process technology leadership into the mobile SoC market I have expressed my doubts. I know how Intel designs their microprocessors, having worked for many of their vendors over the years and having friends at Intel who are actually doing the work. Disclaimer: … Read More
I’ve talked before about how venture capitalists will no longer invest in EDA companies since the prospect for a huge return just isn’t there any more. By big return I mean an acquisition at hundreds of millions of dollars, like SPC, CCR, Ambit, Cadmos, Simplex. But we all know that chips cannot be designed without software… Read More
We’ve gone through two decades where the PC market made the rules for technology. The industry faces a question now: Can a new technology go mainstream without the PC?
By now, you’ve certainly read the news from Cadence on their DDR4 IP for TSMC 28nm. They are claiming a PHY implementation that exceeds the data rates specified for … Read More
The next event in the Jim Hogan Emerging Companies series (organized by the EDAC Emerging Companies Committee) will be on 17th October at Cadence (I’m guessing in building 5 but I’m sure there will be signs). The specific topic this time will be How to Raise Money and How Not to Spend it. The evening will focus on different… Read More
Just a reminder, the semiconductor industry is doing quite well thanks to the fabless semiconductor ecosystem. TSMC, my economic bellwether, reported another great month with a 32% increase over August 2011 and a 16% increase over January-August 2011. TSMC is forecasting Q3 at a 7% increase over Q2, which was an amazing 21% increase… Read More
Micron recently was awarded patents related to ReRAM. As everyone knows, patents are the lifeblood of technology based industries and the memory business is no different. But what can you learn from a patent? In the first of a series of Blogs, Christie Marrian moderator of the ReRAM-Forum asks that question in the context of patents… Read More
The need to exchange larger and larger amount of data from system to the external world, or internally into an application, has pushed for the standardization of interconnect protocol. This allows interconnecting different Integrated Circuits (IC) coming from different vendors. Some protocols have been defined to best fit… Read More
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