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Jasper at DVCon and EJUGby Paul McLellan on 03-13-2014 at 7:05 pmCategories: EDA
The Jasper European User Group meeting (EJUG) is coming up in a couple of weeks. It will be held in the Munich Hilton (which I have stayed in many times, the S-bahn from the airport pretty much stops in the basement) on April 2nd.
The schedule for the day is:
9:00 AM – Registration and continental breakfast
9:30 AM – Jasper… Read More
The biggest market for semiconductors is mobile and an ARM processor is the center of the axle around which it revolves. So everyone in the mobile ecosystem needs to work closely with ARM. At CDNLive earlier this week Cadence and ARM announced that they are deepening their partnership. Most of what they announced makes it a lot easier… Read More
Wearables are going to be a real game changer for the fabless semiconductor ecosystem, absolutely. What other high volume semiconductor market segment has such a low barrier of entry? Speaking of low barrier of entry, the first stop on my Southern California trip last week was Monrovia, the home of Tanner EDA. Tanner is already … Read More
Words often have much deeper meaning than first meets the ear. The story behind a lyric, or a name, reveals origins, philosophical themes, and ideas beyond the obvious. A new effort from Intel conjures up just such an example – a deep reference to makers everywhere.
In a familiar refrain from Queen “Bohemian Rhapsody,” we hear two… Read More
A very popular acronym is ‘WYSIWYG’ – What You See Is What You Get! This is very true and is important to visualize things to make it better in various aspects such as aesthetics, compactness, organization, structure, understandable for correction and so on; the most important, in case of semiconductor design, is being able to identify… Read More
If we look at the past, most of the EDA tools in the semiconductor design space have originated from a designers’ need to do things faster. Regardless of whether it is design exploration, manual design, simulation, verification, optimization (Power Performance Area – PPA) and many other steps in the overall design flow.… Read More
Most programmers can read a code snippet and spot errors, given enough hours in the day, sufficient caffeine, and the right lens prescription. As lines of code run rampant, with more unfamiliar third-party code in the mix, interprocedural and data flow issues become more important – and harder to spot.
Verification IP particularly… Read More
The LETI and STMicro have demonstrated a DSP that can hit 500 MHz while pulling just 460mV – that’s ten times better than anything the industry’s seen so far. Implemented on a 28nm FD-SOI technology, with ultra thin forward body biasing (UTFBB) capability (used to decrease Vth), this DSP can also be exercised at higher voltage when… Read More
As I have mentioned before, I’m part of the Coleman Research Group so you can rent me by the hour to better understand the semiconductor industry. Most of the conversations are by phone but sometimes I do travel to the East Coast, Taiwan, Hong Kong, and China for face-to-face meetings. Generally the calls are the result of an event … Read More
In the current semiconductor design landscape, the design size and complexity of SoCs has grown to large extent with stable tools and technologies that can take care of integrating several IPs together. With that mammoth growth in designs, verification flows are evolving continuously to tackle the verification challenges … Read More
TSMC Process Simplification for Advanced Nodes