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Sidense and TSMC Processes

Sidense and TSMC Processes
by Paul McLellan on 09-14-2013 at 2:21 pm

I’ve written before about the basic capabilities of Sidense’s single transistor one-time programmable memory products (1T-OTP). Just to summarize, it is an anti-fuse device that works by permanently rupturing the gate oxide under the bit-cells storage transistor, something that is obviously irreversible.… Read More


Back To The Future: 50th Anniversary of EDA

Back To The Future: 50th Anniversary of EDA
by Paul McLellan on 09-12-2013 at 1:03 pm

October 16[SUP]th[/SUP] at the Computer History Museum, EDAC is hosting EDA: Back to the Future to celebrate 50 years of EDA. EDAC always has a fall event of some sort and historically it has been the Kaufman Award Dinner. This year, the Kaufman Award was presented (to Chenming Hu) at 50[SUP]th[/SUP] DAC, so the fall EDAC calendar… Read More


Analog Characterization Environment (ACE)

Analog Characterization Environment (ACE)
by Daniel Nenni on 09-12-2013 at 10:00 am

I’m looking forward to the 2013 TSMC Open Innovation Platform Ecosystem Forum to be held Oct. 1[SUP]st[/SUP] in San Jose. One paper in particular that has my attention is titled, “An Efficient and Accurate Sign-Off Simulation Methodology for High-Performance CMOS Image Sensors,” by Berkeley Design Automation & … Read More


The Significance of Apple’s 64 Bit A7

The Significance of Apple’s 64 Bit A7
by Ed McKernan on 09-11-2013 at 9:00 pm

The disappointment amongst analysts is palpable. Dreams of low cost iphones for the masses were kicked away when Apple introduced their two new iphones at the same price points as the old ones. Clearly Apple is playing a different game than what most others are anticipating as the market runs to 5BU. The market has split into the land… Read More


Emerging Trend – Choose DRAM as per Your Design Need

Emerging Trend – Choose DRAM as per Your Design Need
by Pawan Fangaria on 09-11-2013 at 7:00 pm

Lately I was studying about new innovations in memory world such as ReRAM and Memristor. As DRAM (although it has become a commodity) has found its extensive use in mobile, PC, tablet and so on, that was an inclination too to know more about. While reviewing Cadence’s offering in memory subsystems, I came across this whitepaperwhich… Read More


Breaking news: Microsoft acquires Apple!

Breaking news: Microsoft acquires Apple!
by Eric Esteve on 09-11-2013 at 4:51 am

Despite the relative success of their latest smartphone, iPhone15s, the Cupertino firm had never been able to renew with the success of legendary iPhone5s, launched ten years ago, in 2011. As of today, we don’t know if Microsoft will keep iPhone and iPad product lines, or decide to provide these with a lethal injection…

Some history:… Read More


Intel Quark: Synthesizable Core?

Intel Quark: Synthesizable Core?
by Paul McLellan on 09-10-2013 at 1:43 pm

At IDF Brian Krzanich gave the keynote. I won’t summarize the whole thing here but just talk about one part that was something they had actually managed to keep secret ahead of time: Quark.

Quark is a synthesizable core. It uses 1/10th power of Atom and is 1/5 size. Now I am writing this, I don’t know if this is a fair comparison… Read More


GlobalFoundries Expands in Singapore

GlobalFoundries Expands in Singapore
by Paul McLellan on 09-09-2013 at 8:30 pm

GlobalFoundries has been in Singapore for a long time. Longer than GlobalFoundries has existed in fact. Chartered Semiconductor was started in Singapore in 1987 and GF acquired them in early 2010 less than a year after they were created by spinning out the manufacturing arm of AMD. When GF was started their state of the art fab was… Read More


Cadence Introduces Palladium XP II

Cadence Introduces Palladium XP II
by Paul McLellan on 09-09-2013 at 8:00 pm

Well, despite all the arguments in the blogosphere about what process node palladium’s silicon is, and whether the design team is competent, and why it reports into sales…Cadence has announced their latest big revision of Palladium. Someone seems to be able to get things done. Of course it is bigger and faster and … Read More


TSMC OIP: Mentor’s 5 Presentations

TSMC OIP: Mentor’s 5 Presentations
by Paul McLellan on 09-09-2013 at 6:30 pm

At TSMC’s OIP on October 1st, Mentor Graphics have 5 different presentations. Collect the whole set!

11am, EDA track. Design Reliability with Calibre Smartfill and PERC. Muni Mohan of Broadcom and Jeff Wilson of Mentor. New methodologies were invented for 28nm for smart fill meeting DFM requirements (and at 20nm me may … Read More