At DAC you can measure buzz by how many people are crowded into your booth. I saw a crowd at the Oasys booth, so stopped to take in their 10 minute overview presentation. Here’s what I learned.… Read More
Speeding Design Closure at DAC
Embracing the Chiplet Journey: The Shift to Chiplet-Based ArchitecturesThe semiconductor industry is facing a paradigm shift.…Read More
Chiplets-Based Systems: Keysight’s Role in Design, Testing, and Data ManagementKeysight, with deep roots tracing back to Hewlett-Packard,…Read More
2025 Outlook with Oliver Jones of SondrelOllie is a commercially astute senior leader with…Read More
IEDM 2025 – TSMC 2nm Process Disclosure – How Does it Measure Up?Initial thoughts At IEDM held in December 2024,…Read More
Analysis of Power, Thermal, EM, IR at DAC
Most EDA start-up companies have a narrow product focus to complement existing tool flows, however Invarian is taking a much bolder approach by offering tools for:
- Power analysis
- Thermal analysis
- EM / IR analysis
- 3D Thermal analysis
Analog FastSPICE at DAC
Berkeley DA coined the phrase “Analog FastSPICE”, and I’ve been getting an update from them at DAC for several years now. In Austin I met with Paul Estradathe COO and Patrick Muyshondt.
Paul Estrada
Paul Estrada, COO (circa 2010)
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HW Prototyping and HLS at DAC
I love it when EDA companies send their engineers to DAC because I learn more of the unvarnished truth about their products. I met with Bill Thomas of Aldec to get an update on their HW prototyping boards, then two NEC engineers to learn about High Level Synthesis.
HW Prototyping
Bill Thomas, Research Engineer at Aldec
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EDA Tools from China at DAC
Last year I was surprised at DAC by an un-heard of EDA company from China, ICScape. This year I followed up and spoke with Ravi Ravikumar about what’s new with ICScape in 2013.… Read More
Validating Hard IP & Std Cell Libraries at DAC
The building blocks for every SoC are standard cell libraries that are assembled, designed and verified together. But how do we really know if all the data formats used during design are correct and consistent? To answer that question I spoke with Johan Peetersof Fractal Technologiesat DAC.
Johan Peeters, Rene Donkers
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A 3D Field Solver for Parasitic Extraction Thermal ESD Analysis
The smaller the process node the more necessary it is that you extract accurate parasitics from interconnect and 3D structures in order to analyze timing, thermal effects and ESD compliance. Silicon Frontlinehas EDA tools in all three of these categories, so I met with Dermott Lynchat DAC to get an annual update.
Dermott Lynch,… Read More
Dan Niles: Everything Changed on May 22nd
I listened to Dan Niles’s quarterly report that he does for GSA. He had a lot of the usual background data on savings rates and GDP growth, but the big story is that everything changed on May 22nd and that this will turn out to be a very significant moment. That was the day that the Fed basically announced that it would start to “taper”… Read More
Aart: Technomic Push-Pull
Aart de Geus gave one of the visionary look to the next 50 years of EDA as a warmup to Stephen Wu’s keynote. EDA is enabling the greatest push-pull ever, part of an exponential change on a scale never before seen.
Technologies seem to go through a 50 year technical push phase (driven by improving the technology) followed by a 50… Read More
What is inside the iPhone5s? Samsung or TSMC?
As a semiconductor professional and an Apple customer I’m very interested to see what is inside the iPhone5s. Rumors are spreading, photos are leaking, creating a nice build up to the next release of the mobile device that changed the world.
Honestly, last year I was a bit disappointed with the iPhone5. Inside is the A6 SoC which uses… Read More
IEDM 2025 – TSMC 2nm Process Disclosure – How Does it Measure Up?