At TSMC’s latest earnings call held mid January 2014, an analyst asked TSMC for a revenue forecast for their emerging 2.5/3D product line. C.C. Wei, President and Co-CEO answered: “800 Million Dollars in 2016 ”. TSMC has demonstrated great vision many times before. For me, an enthusiastic supporter of this technology, this statement… Read More




What will drive MEMS to drive I-o-T and I-o-P?
By I-o-P, I mean Internet-of-People- I couldn’t think of anything better than this to describe a technology which becomes your custodian for everything you do; you may consider it as your good companion through life or an invariably controlling spy. This is obvious with the embedded sensor techno-products such as Kolibree, a … Read More
SPICE Circuit Simulator Gets a Jolt
I’ve been using SPICE circuit simulators since 1978, both internally and commercially developed, and a lot has changed since the early days where netlists were simulated in batch mode on time-share mainframes. We used to wait overnight for our simulations to complete, and in the morning had to pickup our output results … Read More
Stop TDDB from getting through peanut butter
There are a few dozen causes of semiconductor failure. Most can be lumped into one of three categories: material defects, process or workmanship issues, or environmental or operational overstress. Even when all those causes are carefully mitigated, one factor is limiting reliability more as geometries shrink – and it… Read More
Is Altera Leaving Intel for TSMC?
There is a rumor making the rounds that Altera will leave Intel and return to TSMC. Rumors are just rumors but this one certainly has legs and I will tell you why and what I would have done if I were Altera CEO John Daane. Altera is a great company, one that I have enjoyed working with over the years, but I really think they made a serious mistake… Read More
Parasitic Debugging in Complex Design – How Easy?
When we talk about parasitic, we talk about post layout design further expanded in terms of electrical components such as resistances and capacitances. In the semiconductor design environment where multiple parts of a design from different sources are assembled together into highly complex, high density SoC, imagine how complex… Read More
Rekeying the IoT with eMTP
For non-volatile storage in IoT devices, there is technology designed to be reprogrammed many times, and technology designed to be programmed once. The many times mode is for application code, while the once mode is for keying and calibration parameters. We are about to enter the IoT rekeying zone, in between these two extremes.… Read More
Wearables the Big Hit at CES
There were a number of trends discernible at CES this year, one of the big ones being wearables, especially in the medical and fitness areas. I wear a FitBit Flex and I have, but rarely wear, a Pebble Watch that links to my iPhone. I would say that at this point they are promising but are more gimmicks than truly useful. My Fitbit measures… Read More
Dan Niles: Strong Developed Markets, Weak Emerging
Yesterday was Dan Niles’s economic review that he presents quarterly for GSA. As always he starts from big macroeconomic picture and ends up looking at the implications for semiconductor end-markets and thus the implication for semiconductors in general and the fabless ecosystem in particular.
The big picture is that… Read More
ESD at TSMC: IP Providers Will Need to Use Mentor to Check
I met with Tom Quan of TSMC and Michael Beuler-Garcia of Mentor last week. Weirdly, Mentor’s newish buildings are the old Avant! buildings where I worked for a few weeks after selling Compass Design Automation to them. Odd sort of déja vu. Historically, TSMC has operated with EDA companies in a fairly structured way: TSMC … Read More
Facing the Quantum Nature of EUV Lithography