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RTL Designers Can Win a GoPro Camera at DAC

RTL Designers Can Win a GoPro Camera at DAC
by Daniel Payne on 04-30-2014 at 10:05 am

DACis just 33 days away and who wouldn’t want a cool GoPro camerato play with? Your manager will certainly want you to first check out what’s new at DAC if your job involves getting to RTL signoff on time and within budget. The creative folks at Atrenta have figured out how to attract us with the offer of winning a GoPro camera,… Read More


IC/Package/Board – Power, Noise and Reliability from ANSYS (Apache DA) at DAC

IC/Package/Board – Power, Noise and Reliability from ANSYS (Apache DA) at DAC
by Daniel Payne on 04-30-2014 at 10:04 am

ANSYS acquired Apache Design Automation back in June 2011and three years later the name “Apache” is being subdued in favor of using just ANSYS. One thing that I noticed right away was a DACfocus on having actual ANSYS customers talk about their hands-on experience using the EDA tools. The following seven customers… Read More


Kurt Shuler: Arteris Presentation at EDPS 2014

Kurt Shuler: Arteris Presentation at EDPS 2014
by Daniel Nenni on 04-30-2014 at 9:00 am

The Electronic Design Process Symposium is an annual workshop run by the IEEE Computer Society of Silicon Valley and the IEEE Council on Electronic Design Automation. I presented there because it’s devoid of product marketing pitches, and is two days of discussion on technical and process issues in SoC design. My slides are here:… Read More


An AMS and RF IC Design Flow

An AMS and RF IC Design Flow
by Daniel Payne on 04-30-2014 at 1:24 am

The big three in EDA are well-know for offering AMS and RF IC design flows, but today you also have alternative EDA vendors available that have capable tools, yet are lessor known. This blog will present an overview of the AMS and RF IC design flowoffered by Silvaco, an EDA company with a strong history in TCAD tools like Utmost IV for… Read More


Designing Change into Semiconductor Techonomics

Designing Change into Semiconductor Techonomics
by Daniel Payne on 04-29-2014 at 5:23 pm

Every industry has famous thought leaders that can summarize where we’ve been and then paint a picture of where we’re headed towards in the future. Often they make statements that become industry expressions, like “Moore’s Law” or the “Internet of Things”. I think that if Synopsys… Read More


More knowledge, less time in FPGA-based prototyping

More knowledge, less time in FPGA-based prototyping
by Don Dingee on 04-29-2014 at 4:00 pm

I recently published a post on LinkedIn titled “Sometimes, you gotta throw it all out” in reference to the innovation process and getting beyond good to better. A prime example has crossed my desk: the new ProtoCompiler software for Synopsys HAPS FPGA-based prototyping systems.

Last week, I spoke with Troy Scott, product marketing… Read More


Tanner EDA Helps Customer Productivity Engineering Increase Efficiency and Lower Cost with No Compromise in Performance

Tanner EDA Helps Customer Productivity Engineering Increase Efficiency and Lower Cost with No Compromise in Performance
by Daniel Nenni on 04-29-2014 at 10:00 am

Tanner EDA is making waves at their customer’s sites as the mixed-signal design suite from Tanner EDA, Incentia Design Systems, Inc. and Aldec, Inc. helps ASIC Design House lower cost and increase efficiency with no compromise in performance. In today’s ‘always on’, Internet of Things connected world, the demand for high-performance,… Read More


Xilinx Quarterly Results: 20nm Prototypes

Xilinx Quarterly Results: 20nm Prototypes
by Paul McLellan on 04-29-2014 at 5:07 am

Xilinx announced their quarterly results last week. Because of their financial year not being aligned with their calendar year this is actually 4th quarter of their 2014 financial year. New Year’s Eve 2015 comes early for Xilinx. The results were very good. As Moshe Gavrielov, the CEO, said on the conference call:XilinxRead More


Carey Robertson: Reliability Checks in Advanced Nodes

Carey Robertson: Reliability Checks in Advanced Nodes
by Daniel Nenni on 04-28-2014 at 8:30 pm

Last week I had the pleasure of presenting at the Electronic Design Process Symposium (EDPS) workshop. This was my first time attending and I was very impressed. There were good presentations but I learned as much from the Q&A and the side conversations before/after/breakfast/lunch/etc. If you have the opportunity to attend,… Read More


FinFET & Multi-patterning Need Special P&R Handling

FinFET & Multi-patterning Need Special P&R Handling
by Pawan Fangaria on 04-28-2014 at 1:00 pm

I think by now a lot has been said about the necessity of multi-patterning at advanced technology nodes with extremely low feature size such as 20nm, because lithography using 193nm wavelength of light makes printing and manufacturing of semiconductor design very difficult. The multi-patterning is a novel semiconductor manufacturing… Read More