Apple iPhone 6 and 6s users are recent converts to the latest growth trend in smart phones, large screens at 5.5″ in size and aiming even higher each year. I’ve owned a 5.5″ smart phone from Samsung for some 3 years now, so have immensely enjoyed the larger screen size to get my daily work done with: web browsing, … Read More
CEO Interview with Dr. Naveen Verma of EnCharge AINaveen Verma, Ph.D., is the CEO and Co-founder…Read More
WEBINAR: Edge AI Optimization: How to Design Future-Proof Architectures for Next-Gen Intelligent DevicesEdge AI is rapidly transforming how intelligent solutions…Read More
Together At Last—Combining Netlist and Layout Data for Power-Aware Verification
The market demanded that gadgets it loves become ever more conscious of their power consumption, and chip designers responded with an array of clever techniques to cut IC power use. Unsurprisingly, these new techniques added to the complexity of IC verification. When you’re verifying a design that has 100+ separate power domains,… Read More
A Brief History of FPGA Prototyping
Verifying chip designs has always suffered from a two-pronged problem. The first problem is that actually building silicon is too expensive and too slow to use as a verification tool (when it happens, it is not a good thing and is called a “re-spin”). The second problem is that simulation is, and has always been, too slow.
When Xilinx… Read More
Samsung to cut Semi Capex 20% due to over capacity
Article confirms market fears…
An article in the Korea Times cites sources that say Samsung will cut Semi Capex by 20% due to current oversupply and weak pricing. This is obviously a huge negative as Capex for 2016 will certainly be down significantly from 2015 given these cuts which follow on cuts by Intel and others. We can… Read More
Electromigration Analysis and FinFET Self-Heating
FinFET processes provide power, performance, and area benefits over planar technologies. Yet, a vexing problem aggravated by FinFET’s is the greater local device current density, which translates to an increased concern for signal and power rail metal electromigration reliability failures. There is a critical secondary… Read More
SEMI SMC: Atoms Still Don’t Scale
Last Tuesday was the SEMI’s annual Strategic Materials Conference (SMC). The opening keynotes were given by Gary Patton, the CTO of GlobalFoundries, and Mark Thirsk, Managing Partner of Linx Consulting. This year it was held in the Computer History Museum (which always makes the commute interesting since you have to fight… Read More
Why Sidense OTP is Like the Armored Car of NVM
I have written about Sidense before, but last week at the TSMC Open Innovation Platform Forum, I had a chance to hear a talk by, and have lunch with Betina Hold Director of R&D at Sidense. Here is what I learned.
Sidense has been focusing on the growing market in what they like to call the smart connected universe. It is best to think… Read More
Krivi Specialty I/O Library Support UMC 28nm
There is an industry consensus about 28nm, the technology node is here to stay, and to stay for very long. If we except 20nm node, which by opposition will have a very short lifetime, 28nm is the last node following the economic part of Moore’s law: designing on smaller technology allows building cheaper IC when you integrate the same… Read More
How GlobalFoundries’ CTO Nearly Became a Lawyer…Called Funkhauser
I sat down for a chat with Gary Patton, the CTO of GlobalFoundries, at today’s SEMI Strategic Materials Conference where he had just given one of the keynotes (which I’ll cover another time). His family name isn’t really Patton, his grandfather’s name was Funkhauser, but his step-grandfather’s… Read More
Enterprise Design Management Comes of Age
The motivations for having a data and process management system in place for semiconductor design have existed for a long time. I am reluctant to admit it, but I remember early efforts to do this back in the 80’s at Valid Logic. Cadence was also developing this capability in house through the early 90’s. Back then designs were much … Read More
TSMC N3 Process Technology Wiki