Linear pluggable optics target data center energy savingsData center density continues growing, driving interconnect technology…Read More
Bird’s Eye View Magic: Cadence Tensilica Product Group Pulls Back the CurtainEven for experienced technologists some technologies can seem…Read More
Siemens EDA Offers a Comprehensive Guide to PCIe® Transport SecurityIt is well-known that there is more data…Read More
I previously published a summary of day 1 of SPIE and I wanted to follow up with observations from successive days.
SPIE, the international society for optics and photonics, was founded in 1955 to advance light-based technologies.Serving more than 256,000 constituents from approximately 155 countries, the not-for-profit … Read More
Chip design is largely about assembling pre-designed IP, either developed in other groups in the same company, or brought in from a 3rd party, or occasionally developed within the SoC design group itself. But that makes it sound like it is a bunch of blocks linked together with some interconnect, but of course another important … Read More
During my childhood in my native place in India, although there were good watches around from Seiko, Citizen and some of the Indian companies, I used to see some old men and women never using any watch but still being fairly accurate in perceiving time by just watching the position of sun, or moon, or the shadow formed by a certain object.… Read More
You may already have heard today’s big news in the semiconductor fabless ecosystem that Intel is apparently in talks to buy Altera. I embarrassed myself predicting that Samsung were in talks to buy Freescale (which, of course, they might have been but NXP won that particular race). But this time it is definite enough that … Read More
China Mobile’s bid to go for 3-mode Long-Term Evolution (LTE) has led to the first major breakthrough, $65 LTE handsets, and here baseband and application processors provided by chipmakers like Leadcore Technology, MediaTek and Spreadtrum Communications have all one thing in common: DSP cores from CEVA Inc.
The advent… Read More
ESD stands for electro-static discharge and deals with the fact that chips have to survive in an electrically hostile environment: people, testers, assembly equipment, shipping tubes. All of these can carry electric charge that has the “potential” (ho-ho) to damage the chip irreversibly. Historically this was… Read More
I remember a couple of decades ago, my father used to go to a nearby doctor’s clinic to get his blood pressure and sugar levels checked. I guess, in around 1990s small electronic kits became available to measure these usual daily health indicators and instantly display the numbers. I bought a few for my father then. Today, the scene… Read More
Engineers love acronyms and my latest blog post has three acronyms in the title alone, so hopefully you are doing or considering SoC designs with the AMBA AXI4(Advanced eXtensible Interface 4) interface specification along with PCI Express (Peripheral Component Interconnect Express). One big motivation for using semiconductor… Read More
Earlier this week it was the Synopsys user group meeting SNUG. Not just any old SNUG but the 25th Annual SNUG. The first one was 15th March 1991 and was attended by 100 people. At the time, Synopsys had annual revenues of $22M. This year, the various SNUGs around the world will have a total attendance of 10,000 people and Synopsys revenue… Read More
Today an SoC cannot be without multiple IP blocks integrated together in the most optimal manner. In such an environment, it’s natural that interoperability and configurability of an IP get prime considerations to achieve the best PPA (Power, Performance and Area) for the SoC containing that IP. While PPA is a basic criterion … Read More
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