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Banks and Retailers need to win in IOT

Banks and Retailers need to win in IOT
by Sudeep Kanjilal on 05-26-2016 at 7:00 am

In the runtime for the current mobile ecosystem – apps:

  • Average user has 21 apps on her smart phone, out of the total 1.5m apps on app-store
  • While apps account for more than half the time user spends on digital/smart platform, an average user spend more than 40% of that time on a single app
  • 2/3rd of all smartphone user did not download
Read More

ARM tests out TSMC 10FinFET – with two cores

ARM tests out TSMC 10FinFET – with two cores
by Don Dingee on 05-25-2016 at 4:00 pm

About 13 months ago, the leak blogs posted news of “Artemis” on an alleged ARM roadmap slide, supposedly a new 16FF ARM core positioned as the presumptive successor to the Cortex-A57. Now, we’re finding out what “Artemis” may actually be, inside a multi-core PPA test chip on TSMC 10FinFET.… Read More


Who protects power protection chips?

Who protects power protection chips?
by Tom Simon on 05-25-2016 at 12:00 pm

Power protection chips are widely used these days to protect sensitive circuitry from over-voltage and over-current stress. However, these workhorse chips are often subjected to extraordinary thermal stress themselves and need to be protected from burning up – literally.

Power protection chips work like electronic fuses,… Read More


IMEC Technology Forum (ITF) – IC Innovation

IMEC Technology Forum (ITF) – IC Innovation
by Scotten Jones on 05-25-2016 at 7:00 am

IMEC is a technology research center located in Belgium that is one of the premier semiconductor research centers in the world today. The IMEC Technology Forum (ITF) is a two-day event attended by approximately 1,000 people to showcase the work done by IMEC and their partners.

Luc Van Den Hove is the president and CEO of IMEC and he… Read More


TSMC Leads Again with 3-D Packaging!

TSMC Leads Again with 3-D Packaging!
by Daniel Nenni on 05-24-2016 at 4:00 pm

Continuing to find new ways to extend Moore’s Law, the foundry and technology leader is ready to show off its wafer level system integration prowess with two scalable platforms targeting key growth markets.

CoWoS® (Chip-On-Wafer-On-Substrate) goes after high-performance applications, providing the highest bandwidth and… Read More


Autotalks’ New V2X Processor Integrates CEVA-XC DSP to Support IEEE802.11p and WiFi

Autotalks’ New V2X Processor Integrates CEVA-XC DSP to Support IEEE802.11p and WiFi
by Eric Esteve on 05-24-2016 at 12:00 pm

V2X stands for Vehicle to Everything and to be specific, V2X technology connects vehicles to other vehicles (V2V), infrastructure (V2I), motorcycles (V2M) and pedestrians (V2P) within wireless range for safety and mobility applications. If you consider that the US Department of transportation (USDOT) is expected to publish… Read More


5G, Video and SDNs – High Volume Drivers for Photonic Systems-on-Chip (PSoC)

5G, Video and SDNs – High Volume Drivers for Photonic Systems-on-Chip (PSoC)
by Mitch Heins on 05-24-2016 at 7:00 am

The move towards 5G networks with demands for decreased latency ( 100 devices/m[SUP]2[/SUP]), and the desire to flexibly configure and integrate mobile, fixed, optical and satellite telecommunications is putting tremendous pressure on the design of next generation telecom equipment. Silicon photonics promises to be the… Read More


5G, Video and SDNs – High Volume Drivers for Photonic Systems-on-Chip (PSoC)

5G, Video and SDNs – High Volume Drivers for Photonic Systems-on-Chip (PSoC)
by Mitch Heins on 05-24-2016 at 7:00 am

The move towards 5G networks with demands for decreased latency ( 100 devices/m[SUP]2[/SUP]), and the desire to flexibly configure and integrate mobile, fixed, optical and satellite telecommunications is putting tremendous pressure on the design of next generation telecom equipment. Silicon photonics promises to be the… Read More


Testing IGBTs before they go into EVs

Testing IGBTs before they go into EVs
by Don Dingee on 05-23-2016 at 4:00 pm

In the pages of SemiWiki, we are usually talking about what to do with billions of really small transistors – for a change of pace today, we’ll discuss what to do with a few really big ones. Mentor Graphics has just announced their latest MicReD platform for thermal testing of IGBTs, experiencing a resurgence (pun intended) thanks… Read More


What Does an MPW and a Pizza Have in Common?

What Does an MPW and a Pizza Have in Common?
by Daniel Nenni on 05-23-2016 at 12:00 pm

Design starts are critical to the growth of the semiconductor industry so enabling them is a common theme on SemiWiki. One thing we have not covered in detail is multi-project wafer services (MPW) which is the equivalent of ride sharing through the initial mask and wafer process. Larger semiconductor companies already do this … Read More