Now that the dust has settled let’s talk about the recent TSMC OIP Ecosystem Forum. This was the 6[SUP]th[/SUP] annual OIP which hosts more than 1,000 attendees from TSMC’s top customers and partners. Presenting this year were TSMC VP and CTO Dr. Jack Sun, TSMC VP of R&D Dr. Cliff Hou, and ARM EVP of Incubation Businesses Dr. Dipesh… Read More


CCIX shows up in ARM CMN-600 interconnect
All the hubbub about FPGA-accelerated servers prompts a big question about cache coherency. Performance gains from external acceleration hardware can be wiped out if the system CPU cluster is frequently taking hits from cache misses after data is worked on by an accelerator.
ARM’s latest third-generation CoreLink CMN-600 … Read More
Meet the POWER9 Chip Family
When you looked at a chip in the past you primarily were concerned with two things: the speed of the chip, usually expressed in GHz, and how much power it consumed. Today the IBM engineers preparing the newest POWER chip, the 14nm POWER9, are tweaking the chips for the different workloads it might run, such as cognitive or cloud, and… Read More
Low power physical design in the age of FinFETs
Low power is now a goal for most digital circuit designs. This is to reduce costs for packaging, cooling, and electricity; to increase battery life; and to improve performance without overheating. I talked to the experts on physical design for ultra-low power at Mentor Graphics recently about the challenges to P&R tools and… Read More
Cadence DSPs float for efficiency in complex apps
Floating-point computation has been a staple of mainframe, minicomputer, supercomputer, workstation, and PC platforms for decades. Almost all modern microprocessor IP supports the IEEE 754 floating-point standard. Embedded design, for reasons of power and area and thereby cost, often eschews floating-point hardware… Read More
16nm HBM Implementation Presentation Highlights CoWoS During TSMC’s OIP
Once a year, during the TSMC’s Open Innovation Platform (OIP) Forum you can expect to see cutting edge technical achievements by TSMC and their partners. This year was no exception, with Open-Silicon presenting its accomplishments in implementing an HBM reference design in 16nm. It’s well understood that HBM offers huge benefits… Read More
Power Exploration at RTL Design with Mentor PowerPro
There was a comment recently that design for low power is not an event, it’s a process; that comment is absolutely correct. Power is affected by everything in the electronic ecosystem, from application software all the way down to layout and process choices. Yet power as a metric is much more challenging to model and control than … Read More
It’s a heterogeneous world and cache rules it now
Cache evolved when the world was all about homogeneous processing and slow and expensive shared memory. Now, compute is just part of the problem – devices need to handle display, connectivity, storage, and other tasks, all at the same time. Different, heterogeneous cores handle different workflows in the modern SoC, and the burden… Read More
Intel Foundry Rounds Out IP Lineup With ARM at IDF 2016
There are always debates on who does what best in the semiconductor industry, but most agree that Intel is the best in process and transistor technology. This leadership has served the company extremely well over the last few decades and allowed them to reach a position of dominance in the PC and server semiconductor markets. In … Read More
What Will Kill ROP Cyberattacks?
IBM recently announced a software-oriented solution to help eradicate Return Oriented Programming (ROP) malware attacks. ROP is a significant and growing problem in the industry. Crafty hackers will use snippets of code from other trusted programs and stitch it together to create their attacks. It has become a very popular… Read More
A Quick Tour Through Prompt Engineering as it Might Apply to Debug