In the blur of activities at DAC last year I visited the Mentor booth a few times and had just a few minutes to glance at a 3D TV display that didn’t require me to wear any funny glasses, kind of novel I thought at the time because I’ve read that the market of 3D TV sets is being hampered by requiring viewers to wear glasses. The… Read More
Arteris Highlights a Path to Scalable Multi-Die Systems at the Chiplet SummitAt the recent Chiplet Summit, presentations, discussions and…Read More
Captain America: Can Elon Musk Save America's Chip Manufacturing Industry?Intel has posted three consecutive years of falling…Read More
WEBINAR: Reclaiming Clock Margin at 3nm and BelowAt 3nm and below, clock networks have quietly…Read More
WEBINAR: HBM4E Advances Bandwidth Performance for AI TrainingThe rapid proliferation of LLMs and other AI…Read More
Siemens Wins Best in Show Award at Chiplet Summit and Targets Broad 3D IC Design EnablementThe recent Chiplet Summit in Santa Clara was…Read MoreContext is Everything – especially for autonomous vehicle IP
GM has just announced that it will introduce a car with no steering wheel or pedals in 2019. According to their statement, they have already planned four phases of their autonomous driving system, and they will plan many more. However, before we jump into this latest car and not grab the wheel for a spin, it is reasonable to ask about… Read More
TSMC 5nm and EUV Update 2018
The TSMC Q4 2017 earnings call transcript is up and I found it to be quite interesting for several reasons. First and foremost, this is the last call Chairman Dr. Morris Chang will participate in which signifies the end of a world changing era for me and the fabless semiconductor ecosystem, absolutely. TSMC announced his retirement… Read More
Simulation and Formal – Finding the Right Balance
Simulation dominates hardware functional verification today and likely will continue to dominate for the foreseeable future. Meanwhile formal verification, once thought to be a possible challenger for the title, has instead converged on a more effective role as a complement to simulation. Formal excels at finding problems… Read More
How many engineers does it take to get an IoT security certificate?
Spoiler alert, the answer is none!
Let me take you back to the beginning to explain that answer.
For the sake of this discussion, I will reduce a complex IoT solution to three fundamental blocks:
- IoT node
- IoT Gateway
- IoT Server
The IoT node is a sensor that converts analog, physical world context into digital data. The node has to have… Read More
Autonomous Automobile Update ISS 2018
As a car enthusiast and a semiconductor professional the latest automotive trends are of great interest to me. My father raced sports cars and I remember being part of the pit crew (but not really) and impatiently waiting for my turn to drive. The years before my 16[SUP]th[/SUP] birthday when I could legally drive were the slowest… Read More
A New Year’s resolution: Turn off computers
Facebook’s recent acknowledgment that social media may be making its users feel bad in some cases is a significant milestone. So far, the technology industry hardly has talked about the downsides of their products. Now a realization seems to be setting in that perhaps something has gone wrong along the way.
Academic research that… Read More
Moore’s Law Drives Foundries and IP Providers
2017 was a banner year for semiconductor sales as they topped $400B for the first time, an increase of some 20%, there is happiness in Silicon Valley, Taiwan, South Korea, and well, everywhere. With the foundries pushing to ever-smaller process dimensions and even going back to mature nodes and offering more variations that are… Read More
ISS 2018 – The Impact of EUV on the Semiconductor Supply Chain
I was invited to give a talk at the ISS conference on the Impact of EUV on the Semiconductor Supply Chain. The ISS conference is an annual gathering of semiconductor executives to review technology and global trends. In this article I will walk through my presentation and conclusions.… Read More
Thermal Modeling for ADAS goes MultiPhysics
In electronic system design, we have grown comfortable with the idea that different regimes of analysis, such as the chip, the package and the system, or electrical, thermal and stress are more or less independent – what starts in one regime stays in that regime, give or take some margin information passed onto other regimes. And… Read More


Silicon Insurance: Why eFPGA is Cheaper Than a Respin — and Why It Matters in the Intel 18A Era