Alchip is Paving the Way to Future 3D Design InnovationAt the recent TSMC OIP Ecosystem Forum in…Read More
GaN HEMT modeling with ANN parameters targets extensibilityDesigners choosing gallium nitride (GaN) transistors may face…Read More
AMAT has OK Qtr but Mixed Outlook Means Weaker 2025 - China & Delays & CHIPS Act?- AMAT has OK QTR but outlook below…Read More
More Headwinds - CHIPS Act Chop? - Chip Equip Re-Shore? Orders Canceled & Fab Delay- CHIPS Act more likely to be maimed…Read More
In the dynamic realm of technological innovation, collaborations and partnerships often serve as catalysts for groundbreaking advancements. Continuing along this trajectory, Ansys, a global leader in engineering simulation software, has forged a partnership with Intel Foundry to enable multiphysics chip design. The … Read More
In the technology realm of artificial intelligence (AI) and high-performance computing (HPC), the demand for higher throughput and efficiency has never been greater. To meet these evolving demands, innovative memory solutions have emerged as critical enablers, paving the way for transformative advancements in computing… Read More
Many years ago, I remember discussions around islands of automation/silos. Within the scope of any given silo there is plenty of automation to handle tasks relevant to that phase. But managing the full lifecycle from concept through manufacturing to field support must cross between silos, and those transitions are not as clean… Read More
With the advent of IoT devices, vehicles have become increasingly interconnected, offering enhanced automation, connectivity, electrification, and shared mobility. However, this progress also brings forth unprecedented challenges, particularly in ensuring the safety and security of automotive electronics. The complexity… Read More
Customer case studies have always been my favorite source of information. Press releases are a great start but there is always more to the story. Fortunately, I had the opportunity to speak with Sumit Vishwakarma, principal product manager at Siemens EDA about their recent press release with Interchip. I was an advisor to Berkeley… Read More
In today’s rapidly evolving semiconductor industry, the design and integration of intellectual property (IP) play a pivotal role in achieving competitive advantage and market success. Whether sourced from commercial IP providers or developed in-house, ensuring that IP designs are compliant with signoff requirements… Read More
The next design revolution is clearly upon us. Traditional Moore’s Law is slowing, but the exponential demand for innovation and form factor density is not. When you can no longer get it done with a single monolithic chip, moving to a multi-die approach is the answer. This emerging design methodology has many challenges – supply… Read More
– High NA EUV’s coming out party – “Dawn” of the Angstrom Era
– Well attended, positive vibes, not much new but good progress
– Concerns about Samsung slowing spend while Intel accelerates
– KLA reticle inspection quandary – Risky business in China
Dan is joined by Jan Pantzar vice president of sales and marketing at VSORA, a provider of high-performance generative AI and ADAS chip solutions based in France. Mr. Pantzar gained extensive experience in the semiconductor, IP and software industries through building and managing organizations around the globe. Previous … Read More
Larry has grown Sarcina from designing semiconductor packages for a few small companies, to doing package designs for top semiconductor companies around the world. From 2014 to 2018, Larry led the expansion of Sarcina beyond package design into final test and wafer sort hardware and software development.
Larry is a semiconductor… Read More
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