I wrote recently about a yield problem which mobile vendors have been finding for devices built in advanced technologies. This was a performance issue (the devices worked fine at lower clock speeds), pointing to a discrepancy in some devices between predicted and observed timing. These were experienced design teams, using state… Read More



ISO 26262: Automotive electronics safety gets an update in 2018
In the field of automotive electronics, the year 2011 was a long time ago. So, it is about time that the initial ISO 26262 specification that was adopted back then gets an update. The latest version will be known as ISO26262:2018 and will expand the scope of the original to cover more types of vehicles. It will add an entire section on… Read More
2018 Women in Engineering Achievement Award
Having spent my entire thirty plus year career in semiconductors and design enablement I have seen quite a change in diversity. When I first started I remember thinking that height and weight was the only diversity here in Silicon Valley. My wife really noticed it when she attended her first Design Automation Conference in 1985 … Read More
Virtuoso at CDNLive – A Press Briefing With Yuval Shay
At CDNLive Silicon Valley 2018, I talked with Yuval Shay, Director of Product Management of Cadence Custom IC & PCB Group to scope out some more details on the recent Virtuoso product refresh announced earlier in the morning by Cadence Sr. VP & GM of the same group, Tom Beckley.
Tom shared his view on enabling the fourth industrial… Read More
ARM IoT Mbed Update
Normally press release events with ARM tend to be somewhat arms-length – a canned pitch followed by limited time for Q&A. Through a still unexplained calendar glitch I missed a scheduled call for a recent announcement. To make up I had the pleasure of a 1-on-1 with Hima Mukkamala, GM of IoT cloud services at ARM. Hima is a heavy … Read More
Hard IP for an embedded FPGA
As Moore’s Law enables increased integration, the diversity of functionality in SoC designs has grown. Design teams are seeking to utilize outside technical expertise in key functional areas, and to accelerate their productivity by re-using existing designs that others have developed. The Intellectual Property (IP) industry… Read More
imec and Cadence on 3nm
One of the more frequent questions I get, “What is next after FinFETs?” is finally getting answered. Thankfully I am surrounded by experts in the process technology field including Scotten Jones of IC Knowledge. I am also surrounded by design enablement experts so I really am the man in the middle which brings us to a discussion between… Read More
Intel 10nm Yield Issues
On their first quarter earnings call Intel announced that volume production of 10nm has been moved from the second half of 2018 to 2019 due to yield issues. Specifically, they are shipping 10nm in low volume now, but yield improvement has been slower than anticipated. They report that they understand the yield issues but that improvements… Read More
Data Center Powers Intel but 10NM Still Slow
Intel (INTC) blew away expectations based on strong performance in the data center. Revenues of $16.1B versus street of $15.05B and EPS of $0.93 versus street of $0.72. While revenue was up 9% over prior year, earnings were 50% higher. Guidance is for Q2 revenue of $16.3B and EPS of $0.85 versus street of $15.55B and EPS of $0.81. IOT,… Read More
Samsung has another record quarter in chips
Samsung throws further gas on the fire of weak handset and CAPEX not set but will be down versus 2017. Samsung reported revenues of KRW 60.56 Trillion and KRW 15.64 Trillion operating profit ($56B and $15B). Chips accounted for whopping KRW 11.55 Trillion in operating profit on revenues of KRW 20.78 Trillion ( $11B and $19B)….a… Read More
Intel Foundry Delivers!