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Three Reasons Why You Should NOT Miss 56thDAC

Three Reasons Why You Should NOT Miss 56thDAC
by Daniel Nenni on 05-10-2019 at 7:00 am

Reason number ONE:The next five DACs will be in San Francisco and this will probably be the last one held in Las Vegas so you absolutely do NOT want to miss it. One of my most memorable DACs was in Las Vegas in 1985. My wife came with me for our second honeymoon and, by definition, it was just that, a honeymoon. This year we will probably spend… Read More


ESD Alliance CEO Outlook Features Powerhouse Lineup

ESD Alliance CEO Outlook Features Powerhouse Lineup
by Bob Smith on 05-09-2019 at 2:00 pm

Just two more weeks before the 2019 CEO Outlook Thursday, May 23, at SEMI. If you haven’t registered yet, do so today. We’re expecting a full house as a result of our powerhouse lineup and networking opportunities.

That lineup includes Ed Sperling, editor in chief of Semiconductor Engineering, who will serve as moderator. Panelists… Read More


Bottom of a Semiconductor Canoe Cycle Shape

Bottom of a Semiconductor Canoe Cycle Shape
by Robert Maire on 05-09-2019 at 12:00 pm

Nice numbers despite the cycle bottom
KLA put up EPS of $1.80 versus street of $1.67 on revenues of $1.097B versus street of $1.08B. However guidance was weaker than the street was hoping for with a range of $1.21B to $1.29B in revenues generating between $1.55 and $1.85 in non GAAP EPS. This is compared to current street estimates … Read More


Meeting Automotive IC Design Challenges for Safety using On-Chip Sensors

Meeting Automotive IC Design Challenges for Safety using On-Chip Sensors
by Daniel Payne on 05-09-2019 at 7:00 am

I’ve been driving cars since 1978 and have even done a few DIY repairs in the garage, so I know how warm the engine compartment, transmission or exhaust system can become which makes automotive IC design rather unique in terms of the high temperature and voltage ranges that an electronic component is subjected to. Our safety… Read More


eSilicon ASICs all in the Google Cloud

eSilicon ASICs all in the Google Cloud
by Daniel Nenni on 05-08-2019 at 12:00 pm

Having just completed a cloud evaluation for SemiWiki I can tell you why eSilicon chose Google. Simply put, they are working harder to get cloud business. Google ($4B) is the number five cloud provider behind Microsoft ($21.2B), Amazon ($20.4B), IBM ($10.3B) and Oracle ($6.08B). There is a lot of money in the cloud and a lot more … Read More


Anirudh Keynote at CDNLive 2019

Anirudh Keynote at CDNLive 2019
by Bernard Murphy on 05-08-2019 at 7:00 am

Anirudh Devgan (President of Cadence), gave the third keynote at CDNLive Silicon Valley this year. He has clearly become adept in this role. He has a big, but supportable vision for Cadence across markets and technologies and he’s become a master of the annual tech reveals that I usually associate with keynotes.


Anirudh opened … Read More


When Artificial Intelligence Becomes Emotionally Intelligent

When Artificial Intelligence Becomes Emotionally Intelligent
by Krishna Betai on 05-07-2019 at 12:00 pm

“AI is the biggest risk we face as a civilization.” Words from the visionary Tesla CEO, Elon Musk. After each iteration of innovation, artificial intelligence edges closer to replicating the human brain; people fear that AI would soon steal their jobs, which has already started happening in some parts of the world. Yet, humans … Read More


Design IP in 2018: Synopsys and Cadence Increase Market Share…

Design IP in 2018: Synopsys and Cadence Increase Market Share…
by Eric Esteve on 05-07-2019 at 7:00 am

…but ARM, Imagination, MIPS or Ceva have declined and lose market share. Semiconductor design IP market is still doing good in 2018, with 6% growth year over year. It’s half the growth rate seen in 2017, 2016 and 2015 and the growth decline is imputable to bad results from ARM, the market leader, but also from Imagination (#4), MIPS… Read More


Blockchain and AI A Perfect Match?

Blockchain and AI A Perfect Match?
by Ahmed Banafa on 05-06-2019 at 12:00 pm

Blockchain and Artificial Intelligence are two of the hottest technology trends right now. Even though the two technologies have highly different developing parties and applications, researchers have been discussing and exploring their combination [6].

PwC predicts that by 2030 AI will add up to $15.7 trillion to the world… Read More


The Evolution of the Extension Implant Part III

The Evolution of the Extension Implant Part III
by Daniel Nenni on 05-06-2019 at 7:00 am

The problem of traditional FinFET Extension Implant doping concerns the awkward 3-dimensional structure of the fin. Because the Extension Implant defines the conductive electrical pathway between the Source/Drains and the undoped channel portion of the fin, it is essential that the fin be uniformly doped all three of its surfaces… Read More