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“Connecting the Divide” at SEMICON Europa

“Connecting the Divide” at SEMICON Europa
by admin on 10-29-2019 at 2:00 pm

Connecting the Divide between Design and Manufacturing is an overarching theme within the ESD Alliance as these two essential semiconductor disciples become more reliant on each other. It’s also the reason we’re hosting  SMART Design, the first system-centric series showcasing advances in electronic system design to be held… Read More


Synopsys’ New Die-to-Die PHY IP – What It Means

Synopsys’ New Die-to-Die PHY IP – What It Means
by Randy Smith on 10-29-2019 at 10:00 am

This morning, Synopsys announced its new Die-to-Die PHY IP. This announcement is critically important as it addresses two major market drivers – the growing need for faster connectivity in the datacenter and similar markets, and a path to better exploit the latest processes by dealing with yield issues for larger dies in a different… Read More


New ARC VPX DSP IP provides parallel processing punch

New ARC VPX DSP IP provides parallel processing punch
by Tom Simon on 10-29-2019 at 6:00 am

The transition to the digital age from a mostly analog world really began with the invention of the A-to-D and D-to-A converters. However scalar processors can easily be overwhelmed by the copious data produced by something as simple as an audio stream. To solve this problem and to really jumpstart the digital age, the development… Read More


Cadence Shows off 5LPE Hercules Implementation

Cadence Shows off 5LPE Hercules Implementation
by Randy Smith on 10-28-2019 at 10:00 am

In a joint presentation given by Samsung, Arm, and Cadence at the Arm TechCon event on October 9, 2019, Cadence showed some results and explained its collaboration project used to implement the new Arm Hercules CPU on Samsung’s advanced 5LPE process. I do not want to minimize the significance of Samsung’s and Arm’s participation… Read More


DAC 2020 – Call for Contributions

DAC 2020 – Call for Contributions
by Daniel Payne on 10-28-2019 at 6:00 am

57DAC in SFO

My first DAC was in 1987 so I’ve seen our industry expand greatly over the years, and I expect that #57DAC on July 19-23, 2020 in SFO to be another exciting event to attend for semiconductor professionals from around the globe. What makes DAC so compelling for me to visit are the people, exhibitors, panel discussions, technical… Read More


GM is Burning

GM is Burning
by Roger C. Lanctot on 10-27-2019 at 11:00 am

What is it about General Motors? The once largest maker of cars in the world (now sixth or seventh) has been in an all-fronts retreat for years – while Wall Street analysts and top GM brass whistle past the graveyard touting gains in the company’s stock price and profitability.

GM has exited key markets including Europe, India and

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Let’s Pass the Hot Cars Act of 2019

Let’s Pass the Hot Cars Act of 2019
by Roger C. Lanctot on 10-27-2019 at 10:00 am

It’s happened again. The 42nd fatality of 2019 in the U.S. from a child being left behind in a hot car has occurred – this time, in New Mexico. While horrific and staggering, the total number of fatalities due to children being left in overheated cars for 2019 is still less than the 54 fatalities suffered in 2018.

According… Read More


TSMC Update Q3 2019 Absolutely!

TSMC Update Q3 2019 Absolutely!
by Daniel Nenni on 10-25-2019 at 6:00 am

This will be a combination of the recent TSMC quarterly report, a look back at Cliff Hou’s keynote at the most recent TSMC conference, and conversations on SemiWiki.com. There has been a lot of press on this but of course the most important points are being missed. Semiconductors are complicated and getting more so, absolutely.… Read More


IP-XACT helps you produce exactly what you need in SoC deliverables

IP-XACT helps you produce exactly what you need in SoC deliverables
by Tom Simon on 10-24-2019 at 10:00 am

If you have ever watched an experienced glass blower, your first thought is that they make it look so easy. I have had the opportunity to blow glass, and I can tell you that it is a constant struggle against temperature, time and muscles to get the glass to do anything like what you want. This is akin to what is required to take the elements… Read More


Accelerating Functional Safety Verification

Accelerating Functional Safety Verification
by Bernard Murphy on 10-24-2019 at 6:00 am

FuSa Verification

Verifying a design for functional safety requirements for an IP or SoC per ISO 26262 is a complex process that can’t be encapsulated in one tool. Process complexities depend on whether the Tier1 or OEM is targeting safety-levels ASIL-A , B, C or D, where ASIL-D applies to anything truly safety-critical such as airbag controls or … Read More