On Tuesday night of IEDM, Applied Materials held a panel discussion “The Future of Logic: EUV is Here, Now What?”. The panelists were: Regina Freed, managing director at Applied Materials as the moderator, Geoffrey Yeap, senior director of advanced technology at TSMC, Bala Haran, director of silicon process research at IBM, … Read More





AI the Matrix and Intel
I would guess that most people have seen or at least heard of the Matrix movies but how many people can remember who vanquished the earth to begin the series? It was artificial intelligence (AI) of course which seemed pretty far fetched 20 years ago, but today not so much. In fact, for those of us in the AI know it seems quite likely in some… Read More
The Tech Week that was December 16-20 2019
As we approach the end of 2019 I wish everybody a Merry Christmas and a Happy New Year. This will be my last update for a few weeks as I will also take a little break over the holiday season.
Despite a lot of people winding down for the year, there was still lots of interesting news from last week with lots of data points pointing to an even
Debugging Hardware Designs Using Software Capabilities
Every few months, I touch base with Cristian Amitroaie, CEO of AMIQ EDA, to learn more about how AMIQ is helping hardware design and verification engineers be more productive. Quite often, his answers surprise me. When he started describing their Design and Verification Tools (DVT) Eclipse Integrated Development Environment… Read More
Network on Chip Brings Big Benefits to FPGAs
The conventional thinking about programmable solutions such as FPGAs is that you have to be willing to make a lot of trade-offs for their flexibility. This has certainly been the case in many instances. Even just getting data across the chip can eat up valuable routing resources and add a lot of overhead. These problems are exacerbated… Read More
Full Solution for eMRAM Coming in 2020
It’s amazing to think that Apollo moon mission used computers that were based on magnetic core memories. Of course, CMOS memories superseded them rapidly. However, over the decades since, memory technologies have advanced significantly, in terms of density, power and new types of technologies, e.g NAND Flash. Ever since the… Read More
Ultra-Short Reach PHY IP Optimized for Advanced Packaging Technology
Frequent Semiwiki readers are no doubt familiar with the rapid advances in 2.5D heterogeneous multi-die packaging technology. A relatively well-established product sector utilizing this technology is the 2.5D integration of logic die with a high-bandwidth memory (HBM) DRAM die stack on a silicon interposer; the interposer… Read More
A VIP to Accelerate Verification for Hyperscalar Caching
Non-volatile memory (NVM) is finding new roles in datacenters, not currently so much in “cold storage” as a replacement for hard disk drives, but definitely in “warm storage”. Warm storage applications target an increasing number of functions requiring access to databases with much lower latency than is possible through paths… Read More
Cadence Continues Photonics Industry Engagement
On November 13, Cadence held its annual Photonics Summit. Cadence has been hosting this event for several years with the intention of advancing the photonics industry. With this event, Cadence has been a catalyst in furthering photonic product development. It’s quite remarkable that Cadence hosts such an event in a field where… Read More
IP to SoC Flow Critical for ISO 26262
In thinking about automotive electronics safety standards, such as ISO 26262, it is easy to jump to the conclusion that they are in reference to systems such as autonomous driving, which are entering the marketplace. In reality, functional safety in automotive electronics plays a significant role in many well-established automotive… Read More
Weebit Nano Moves into the Mainstream with Customer Adoption