At the end of August, TSMC released its 278-page Sustainability Report—an annual document often described as the company’s true “health check,” even more revealing than its financial report.
Though the title suggests a focus on environmental issues, the report spans everything from employee programs to advanced R&D. This year’s edition offered four standout highlights:
-The first-ever disclosure of “Fab R&D,” a peek into how production lines themselves keep innovating.
-Expanded accountability across the supply chain, including a grievance channel for supplier employees.
-Overseas fabs in Arizona and Kumamoto that make TSMC’s green power targets easier to achieve.
-An ultrasonic cooling chip, developed with Silicon Valley startup xMEMS, that could change the way smartphones (and even AI servers) handle overheating.
Together, these details show how TSMC is not only driving semiconductor technology forward but also reshaping the ecosystem around it.
https://cwnewsroom.substack.com/p/exclusive-highlights-tsmc-sustainability-report
Though the title suggests a focus on environmental issues, the report spans everything from employee programs to advanced R&D. This year’s edition offered four standout highlights:
-The first-ever disclosure of “Fab R&D,” a peek into how production lines themselves keep innovating.
-Expanded accountability across the supply chain, including a grievance channel for supplier employees.
-Overseas fabs in Arizona and Kumamoto that make TSMC’s green power targets easier to achieve.
-An ultrasonic cooling chip, developed with Silicon Valley startup xMEMS, that could change the way smartphones (and even AI servers) handle overheating.
Together, these details show how TSMC is not only driving semiconductor technology forward but also reshaping the ecosystem around it.
https://cwnewsroom.substack.com/p/exclusive-highlights-tsmc-sustainability-report