A senior executive from Volkswagen North America kicked off Enterprise Ireland’s first annual “CASE: Driving the Future” mobility symposium last week with the announcement of the launch of its next generation Car-Net connected car platform. The new solution represents a breakthrough by allowing for the customer selection




AMD Intel TSMC menage a trois and the trouble with trouples
- Its “Complicated”- A 3 way Chip Relationship
- Competing for Wafers, Moore’s Law & Love
- Who’s Competing with Whom?
- All’s Fair
The 3 way relationship is more complex than it seems
On the surface it seems simple. AMD and TSMC compete with Intel making its own chips and TSMC making them for AMD. But… Read More
Samsung 2019 Technology Day Recap!
Samsung is a complicated company with a VERY long history. We attempted to capture the Samsung Experience in chapter 8 of our book “Mobile Unleashed: The Origin and Evolution of ARM Processors In Our Devices”. If you are a registered SemiWiki member you can download a free PDF copy in our Books section.
Here is the chapter 8 … Read More
BittWare PCIe server card employs high throughput AI/ML optimized 7nm FPGA
Back in May I wrote an article on the new Speedster7t from Achronix. This chip brings together Network on Chip (NoC) interconnect, high speed Ethernet and memory connections, and processing elements optimized for AI/ML. Speedster7t is a very exciting new FPGA that can be used effectively to accelerate a wide range of processing… Read More
Efficiency – Flex Logix’s Update on InferX™ X1 Edge Inference Co-Processor
Last week I attended the Linley Fall Processor Conference held in Santa Clara, CA. This blog is the first of three blogs I will be writing based on things I saw and heard at the event.
In April, Flex Logix announced its InferX X1 edge inference co-processor. At that time, Flex Logix announced that the IP would be available and that a chip,… Read More
Arm Reveals Custom Instructions, Mbed Partner Governance
At TechCon Arm announced two more advances against competitive threats, one arguably tactical and the other strategic, at least in this writer’s view. The tactical move was to add support for custom instructions, the ability to collapse multiple instructions into a single instruction through customer-added logic which hooks… Read More
“Connecting the Divide” at SEMICON Europa
Connecting the Divide between Design and Manufacturing is an overarching theme within the ESD Alliance as these two essential semiconductor disciples become more reliant on each other. It’s also the reason we’re hosting SMART Design, the first system-centric series showcasing advances in electronic system design to be held… Read More
Synopsys’ New Die-to-Die PHY IP – What It Means
This morning, Synopsys announced its new Die-to-Die PHY IP. This announcement is critically important as it addresses two major market drivers – the growing need for faster connectivity in the datacenter and similar markets, and a path to better exploit the latest processes by dealing with yield issues for larger dies in a different… Read More
New ARC VPX DSP IP provides parallel processing punch
The transition to the digital age from a mostly analog world really began with the invention of the A-to-D and D-to-A converters. However scalar processors can easily be overwhelmed by the copious data produced by something as simple as an audio stream. To solve this problem and to really jumpstart the digital age, the development… Read More
Cadence Shows off 5LPE Hercules Implementation
In a joint presentation given by Samsung, Arm, and Cadence at the Arm TechCon event on October 9, 2019, Cadence showed some results and explained its collaboration project used to implement the new Arm Hercules CPU on Samsung’s advanced 5LPE process. I do not want to minimize the significance of Samsung’s and Arm’s participation… Read More
Should the US Government Invest in Intel?