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Designing Next Generation Memory Interfaces: Modeling, Analysis, and Tips

Designing Next Generation Memory Interfaces: Modeling, Analysis, and Tips
by Mike Gianfagna on 03-04-2020 at 10:00 am

IBIS AMI vs. Transient

At DesignCon 2020, there was a presentation by Micron, Socionext and Cadence that discussed design challenges and strategies for using the new low-power DDR specification (LPDDR5). As is the case with many presentations at DesignCon, ecosystem collaboration was emphasized. Justin Butterfield (senior engineer at Micron)… Read More


LithoVision – Economics in the 3D Era

LithoVision – Economics in the 3D Era
by Scotten Jones on 03-04-2020 at 6:00 am

Slide3

Each year on the Sunday before the SPIE Advanced Lithography Conference, Nikon holds their LithoVision event. This year I had the privilege of being invited to speak for the third consecutive year, unfortunately, the event had to be canceled due to concerns over the COVID-19 virus but by the time the event was canceled I had already… Read More


The Story of Ultra-WideBand – Part 1: The Genesis

The Story of Ultra-WideBand – Part 1: The Genesis
by Frederic Nabki & Dominic Deslandes on 03-03-2020 at 10:00 am

The Story of Ultra WideBand Part 1 SemiWiki

In the middle of the night of April 14, 1912, the R.M.S. Titanic sent a distress message. It had just hit an iceberg and was sinking. Even though broadcasting an emergency wireless signal is common today, this was cutting edge technology at the turn of the 20th century. This was made possible by the invention of a broadband radio developed… Read More


Trends in AI and Safety for Cars

Trends in AI and Safety for Cars
by Bernard Murphy on 03-03-2020 at 6:00 am

AI at the Edge

The potential for AI in cars, whether for driver assistance or full autonomy, has been trumpeted everywhere and continues to grow. Within the car we have vision, radar and ultrasonic sensors to detect obstacles in front, behind and to the side of the car. Outside the car, V2x promises to share real-time information between vehicles… Read More


Reliability Challenges in Advanced Packages and Boards

Reliability Challenges in Advanced Packages and Boards
by Herb Reiter on 03-02-2020 at 10:00 am

CTE Stress ANSYS SemiWiki

Today’s Market Requirements
Complex electronic devices and (sub)systems work for us in important applications, such as aircrafts, trains, trucks, passenger vehicles as well as building infrastructure, manufacturing equipment, medical systems and more. Very high reliability (the ability of a product to meet all requirements… Read More


GLOBALFOUNDRIES Sets a New Bar for Advanced Non-Volatile Memory Technology

GLOBALFOUNDRIES Sets a New Bar for Advanced Non-Volatile Memory Technology
by Mike Gianfagna on 03-02-2020 at 6:00 am

eNVM applications


Whether it’s the solid-state disk in your laptop, IoT/automotive hardware or  edge-based AI, embedded non-volatile memory (eNVM) is a critical building block for these and many other applications. The workhorse technology for this capability has typically been NOR flash (eFlash), but a problem looms as eFlash presents challenges… Read More


Coronavirus Chops SPIE Litho EUV Conference

Coronavirus Chops SPIE Litho EUV Conference
by Robert Maire on 03-01-2020 at 6:00 am

SPIE EUV 2020 Coronavirus

Corona Curtails already quiet SPIE Litho conference
Our best guess is that attendance was off by 30% from last years SPIE conference due to a lack of travelers from many Asian areas obviously out of Corona fear. Even Intel, which is a few miles away was a virtual no-show with a mass cancellation.

More importantly, virtually all after… Read More


Talking Sense With Moortec – The Future Of Embedded Monitoring Part 2

Talking Sense With Moortec – The Future Of Embedded Monitoring Part 2
by Stephen Crosher on 02-28-2020 at 10:00 am

Stephen Crosher Moortec CEO Square High Res

The rate of product development is facing very real challenges as the pace of silicon technology evolution begins to slow. Today, we are squeezing the most out of transistor physics, which is essentially derived from 60-year-old CMOS technology. To maintain the pace of Moore’s law, it is predicted that in 2030 we will need transistors… Read More


An Important Step in Tackling the Debug Monster

An Important Step in Tackling the Debug Monster
by Daniel Nenni on 02-28-2020 at 6:00 am

AMIQ EDA Compare Report SemiWiki

If you’ve spent any time at all in the semiconductor industry, you’ve heard the statement that verification consumes two-thirds or more of the total resources on a chip project. The estimates range up to 80%, in which case verification is taking four times the effort of the design process. The exact ratio is subject to debate, but… Read More


Navigating Memory Choices for Your Next Low-Power Design

Navigating Memory Choices for Your Next Low-Power Design
by Mike Gianfagna on 02-27-2020 at 10:00 am

Memory options

Choosing a memory architecture can be a daunting task. There are many options to choose from, each with their own power, performance, area and cost profile. The right choice can make a new design competitive and popular in the market. The wrong choice can doom the whole project to failure.

Vadhiraj Sankaranarayanan, senior technical… Read More