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How does your EDA supplier ensure software quality?

How does your EDA supplier ensure software quality?
by admin on 05-30-2024 at 10:00 am

fig1 anacov components

In the fast-paced world of electronic design automation (EDA) software development, maintaining high code quality while adhering to tight deadlines is a significant challenge. Code coverage, an essential metric in software testing, measures the extent to which a software’s source code is executed in tests. High code… Read More


The Fallacy of Operator Fallback and the Future of Machine Learning Accelerators

The Fallacy of Operator Fallback and the Future of Machine Learning Accelerators
by Kalar Rajendiran on 05-30-2024 at 6:00 am

Chimera GPNPU Block Diagram

As artificial intelligence (AI) and machine learning (ML) models continue to evolve at a breathtaking pace, the demands on hardware for inference and real-time processing grow increasingly complex. Traditional hardware architectures for acceleration are proving inadequate to keep up with these rapid advancements in ML … Read More


Secure-IC Presents AI-Powered Cybersecurity

Secure-IC Presents AI-Powered Cybersecurity
by Mike Gianfagna on 05-29-2024 at 10:00 am

Secure IC Presents AI Powered Cybersecurity

Design & Reuse held its IP-SoC Silicon Valley 24 event on April 25th, 2024, at the Hyatt Regency Santa Clara. The agenda was packed with many relevant and compelling presentations from companies large and small. I attended one presentation on security that stood out for me. Secure-IC presented “AI-powered cybersecurity:Read More


Mastering Copper TSV Fill Part 2 of 3

Mastering Copper TSV Fill Part 2 of 3
by John Ghekiere on 05-29-2024 at 8:00 am

Mastering Copper TSV Fill Part 2 of 3

Establishing void-free fill of high aspect ratio TSVs, capped by a thin and uniform bulk layer optimized for removal by CMP, means fully optimizing each of a series of critical phases. As we will see in this 3-part series, the conditions governing outcomes for each phase vary greatly, and the complexity of interacting factors means… Read More


Using LLMs for Fault Localization. Innovation in Verification

Using LLMs for Fault Localization. Innovation in Verification
by Bernard Murphy on 05-29-2024 at 6:00 am

Innovation New

We have talked about fault localization (root cause analysis) in several reviews. This early-release paper looks at applying LLM technology to the task. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and now Silvaco CTO) and I continue our series on research… Read More


Elevating Your SoC for Reconfigurable Computing – EFLX® eFPGA and InferX™ DSP and AI

Elevating Your SoC for Reconfigurable Computing – EFLX® eFPGA and InferX™ DSP and AI
by Kalar Rajendiran on 05-28-2024 at 10:00 am

Use Case eFPGA Complementing Signal Processing

Field-Programmable Gate Arrays (FPGAs) have long been celebrated for their unmatched flexibility and programmability compared to Application-Specific Integrated Circuits (ASICs). And the introduction of Embedded FPGAs (eFPGAs) took these advantages to new heights. eFPGAs offer on-the-fly reconfiguration capabilities,… Read More


The 2024 Design Automation Conference and Certus Semiconductor

The 2024 Design Automation Conference and Certus Semiconductor
by Daniel Nenni on 05-28-2024 at 6:00 am

DAC Banner 2024

DAC is right around the corner and this could possibly be the last one in San Francisco for a while so do not miss it. The weather will be absolutely great and there are many things to do outside of the conference including sailing on the bay.

The Design Automation Conference (DAC) is a premier event that focuses on the design and automation… Read More


AI System Connectivity for UCIe and Chiplet Interfaces Demand Escalating Bandwidth Needs

AI System Connectivity for UCIe and Chiplet Interfaces Demand Escalating Bandwidth Needs
by Kalar Rajendiran on 05-27-2024 at 10:00 am

Alphwave Semi UCIe PHY Support for All Package Types

Artificial Intelligence (AI) continues to revolutionize industries, from healthcare and finance to automotive and manufacturing. AI applications, such as machine learning, deep learning, and neural networks, rely on vast amounts of data for training, inference, and decision-making processes. As AI algorithms become … Read More


Webinar – CHERI: Fine-Grained Memory Protection to Prevent Cyber Attacks

Webinar – CHERI: Fine-Grained Memory Protection to Prevent Cyber Attacks
by Mike Gianfagna on 05-27-2024 at 6:00 am

Webinar – CHERI Fine Grained Memory Protection to Prevent Cyber Attacks

Cyber attacks are top of mind for just about everyone these days. As massive AI data sets become more prevalent (and more valuable), data security is no longer “nice to have”. Rather, it becomes critical for continued online operation and success. The AI discussion is a double-edged sword as well. While AI enables many new and life-changing… Read More


Top three challenges for global semiconductor manufacturing in 2024

Top three challenges for global semiconductor manufacturing in 2024
by Stephen Rothrock on 05-26-2024 at 8:00 am

Top three challenges for global semiconductor manufacturing in 2024

Poised for recovery in 2024 and driving toward a historic $1 trillion in revenue, the global semiconductor industry has an incredibly promising future, backed by an unprecedented number of growth drivers, market opportunities, and technology advancements. Nevertheless, amid record greenfield capital investments and government-backed… Read More