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Noose tightens on SMIC- Dead Fab Walking?

Noose tightens on SMIC- Dead Fab Walking?
by Robert Maire on 12-01-2020 at 6:00 am

SMIC US Embargo

-US Administration to “blacklist” SMIC- Cutting off ALL US help
-A slow death versus a quick death (unlike Jinhua)
-There is enough time on way out door to leave scorched earth
-Reports in the Media about SMIC being “Blacklisted”

It has been widely reported that SMIC will be added to the US “Blacklist”… Read More


PLDA Brings Flexible Support for Compute Express Link (CXL) to SoC and FPGA Designers

PLDA Brings Flexible Support for Compute Express Link (CXL) to SoC and FPGA Designers
by Mike Gianfagna on 11-30-2020 at 10:00 am

PLDA Brings Flexible Support for Compute Express Link CXL to SoC and FPGA Designers

A few months ago, I posted a piece about PLDA expanding its support for two emerging protocol standards: CXL™ and Gen-Z™.  The Compute Express Link (CXL) specification defines a set of three protocols that run on top of the PCIe PHY layer. The current revision of the CXL (2.0) specification runs with the PCIe 5.0 PHY layer at a maximum… Read More


ML plus formal for analog. Innovation in Verification

ML plus formal for analog. Innovation in Verification
by Bernard Murphy on 11-30-2020 at 6:00 am

innovation min

Can machine learning be combined with formal to find rare failures in analog designs? ML plus formal for analog – neat! Paul Cunningham (GM, Verification at Cadence), Jim Hogan and I continue our series on research ideas. Here an idea from analog simulation sampling. Feel free to comment.

The Innovation

This month’s pick… Read More


Applied Materials Will Regain Semiconductor Equipment Lead From ASML in 2020

Applied Materials Will Regain Semiconductor Equipment Lead From ASML in 2020
by Robert Castellano on 11-29-2020 at 10:00 am

2020 WFE Share

On December 2, 2019, I posted a SemiWiki article entitled “ASML Will Take Semiconductor Equipment Lead from Applied Materials in 2019.”Since losing its dominance for the first time since 1990 in 2019, Applied Materials is poised to lose its retake the 2020 lead in the semiconductor equipment market. ASML led the… Read More


CD-Pitch Combinations Disfavored by EUV Stochastics

CD-Pitch Combinations Disfavored by EUV Stochastics
by Fred Chen on 11-29-2020 at 6:00 am

CD Pitch Combinations Disfavored by EUV Stochastics

Ongoing investigations of EUV stochastics [1-3] have allowed us to map combinations of critical dimension (CD) and pitch which are expected to pose a severe risk of stochastic defects impacting the use of EUV lithography. Figure 1 shows a typical set of contours of fixed PNOK (i.e., the probability of a feature being Not OK due… Read More


Webinar: 5 Reasons Why Others are Adopting Hybrid Cloud and EDA Should Too!

Webinar: 5 Reasons Why Others are Adopting Hybrid Cloud and EDA Should Too!
by Daniel Nenni on 11-27-2020 at 6:00 am

Rescale SemiWiki

With the complexity of transistors at an all time high and growing foundry rule decks, fabless companies consistently find themselves in a game of catch up. Semiconductor designs require additional compute resources to maintain speed and quality of development. But deploying new infrastructures at this current speed is a tall… Read More


Low Power SRAM Register Files for IoT, AI and Wearables

Low Power SRAM Register Files for IoT, AI and Wearables
by Tom Simon on 11-26-2020 at 10:00 am

SRAM register files

SRAM is the workhorse for on-chip memories, valued for its performance and easy integration with standard processes. The needs of wearable, IoT and AI SOCs have put a lot of pressure on the requirements for all on-chip memories. This is perhaps most evident in the area of power. AI chips that rely heavily on SRAM register files are… Read More


Folding at Home. The Ultimate in Parallel Acceleration

Folding at Home. The Ultimate in Parallel Acceleration
by Bernard Murphy on 11-26-2020 at 6:00 am

COVID spike protein min

You may have heard of Folding at Home. It’s a very creative way that a bioengineering team, based at Washington University in St Louis, are modeling the process of protein folding. Greg Bowman, an associate professor of biochemistry and biophysics at the university directs the project and presented at Arm DevSummit this year. … Read More


China Semiconductor Bond Bust!

China Semiconductor Bond Bust!
by Robert Maire on 11-25-2020 at 10:00 am

China Semiconductor Bond Bust

– Tsinghua $198M Bond Bust
– Good for memory: Samsung Micron LG Toshiba –
– Not good for chip equipment
– Could China Credit Crunch hit more than foundry embargo?
– Damage to China memory positive for other memory makers
– Not good for chip equip if customers can’t get money

China’s… Read More


Cadence is Making Floorplanning Easier by Changing the Rules

Cadence is Making Floorplanning Easier by Changing the Rules
by Mike Gianfagna on 11-25-2020 at 8:00 am

Mixed placement floorplan

SoC designs are getting more complex, resulting in a higher level of difficulty to get anything done. This trend is well-known. What I want to focus on here is how to deal with the issue of complexity. There are many approaches to taming this problem — faster algorithms for one, and improved algorithm efficiency or the ability to run… Read More