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Design and Verification IP: Insights From a SmartDV Insider

Design and Verification IP: Insights From a SmartDV Insider
by Kalar Rajendiran on 09-09-2021 at 10:00 am

SmartDV Range of IP Offerings

Just as SmartTV has become a household term, SmartDV has become a well-known name within semiconductor design and verification circles. SmartDV™ Technologies is the proven and trusted choice for Smart Design IP and a range of Verification Solutions™ from Verification IP, including assertion-based and post-silicon validation… Read More


ASML is the key to Intel’s Resurrection Just like ASML helped TSMC beat Intel

ASML is the key to Intel’s Resurrection Just like ASML helped TSMC beat Intel
by Robert Maire on 09-09-2021 at 6:00 am

TSMC INTEL ASML Hurricane 1

-Intel’s access to high-NA EUV tools may be their elixir of life
-TSMC’s EUV adoption helped it vault faltering Intel & Samsung
-Maybe ASML should invest in Intel like Intel invested in ASML
-Shoe is on the other foot- But cooperation helps chip industry

Intel is dependent upon ASML for its entire future
If Intel… Read More


Can/Will NHTSA Rein in AVs Bad Boys?

Can/Will NHTSA Rein in AVs Bad Boys?
by Roger C. Lanctot on 09-08-2021 at 10:00 am

Autonomous Vehicle AV Bad Boys

There’s a new sheriff in town at the U.S. Department of Transportation in the form of Department Secretary Pete Buttigieg with an acting deputy in Acting Administrator Dr. Steve Cliff at the National Highway Traffic Safety Administration (NHTSA). NHTSA has served notice on bad boy Tesla CEO Elon Musk that it is investigating

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Verifications Horizons 2021, Now More Siemens

Verifications Horizons 2021, Now More Siemens
by Bernard Murphy on 09-08-2021 at 6:00 am

Aero DT min

In a discussion with Tom Fitzpatrick of Siemens EDA he recalled that their Verification Horizons newsletter started 17 years ago, back when they were Mentor. We’ve known about the Siemens acquisition for a while. The deal closed in March 2017, but it wasn’t until January 1, 2021 that the legal entity merger was complete. Which makes… Read More


Ansys IDEAS Digital Forum 2021 Offers an Expanded Scope on the Future of Electronic Design

Ansys IDEAS Digital Forum 2021 Offers an Expanded Scope on the Future of Electronic Design
by Daniel Nenni on 09-07-2021 at 10:00 am

IDEAS Banner ad

For those of you following the latest developments in electronic design it has become clear that the industry is transitioning through an inflection point that is shifting some of the ground rules of design. The increase in the speed and integration density in today’s systems are blurring the lines between chip design and system… Read More


IoT and 5G Convergence

IoT and 5G Convergence
by Ahmed Banafa on 09-05-2021 at 6:00 am

IoT and 5G Convergence

The Convergence of 5G and Internet of Things (IoT) is the next natural move for two advance technologies built to make users lives convenient, easier and more productive. But before talking about how they will unite we need to understand each of the two technologies.

Simply defined; 5G is the next-generation cellular network… Read More


Podcast EP36: Semiconductor Design Acceleration

Podcast EP36: Semiconductor Design Acceleration
by Daniel Nenni on 09-03-2021 at 10:00 am

Dan and Mike are joined by Michael Johnson (MJ), CTO at NetApp. MJ provides “behind the scene” insights into NetApp technology and how it has quietly revolutionized information storage and management for chip design. The key enabling technologies along with specific use cases are discussed. MJ also discusses moving… Read More


The Arm China Debacle and TSMC

The Arm China Debacle and TSMC
by Daniel Nenni on 09-03-2021 at 6:00 am

Barnum and Baily Circus

Having spent 40 years in the semiconductor industry, many years working with Arm and even publishing the definitive history book “Mobile Unleashed: The Origin and Evolution of ARM Processors in Our Devices” plus having spent more than 20 years working with China based companies, I found the recent Arm China media circus quite … Read More


Why Optimizing 3DIC Designs Calls for a New Approach

Why Optimizing 3DIC Designs Calls for a New Approach
by Synopsys on 09-02-2021 at 10:00 am

IC design engineering 3DIC 1024x615 1

The adoption of 3DIC architectures, while not new, is enjoying a surge in popularity as product developers look to their inherent advantages in performance, cost, and the ability to combine heterogeneous technologies and nodes into a single package. As designers struggle to find ways to scale with complexity and density limitations… Read More


Optimize AI Chips with Embedded Analytics

Optimize AI Chips with Embedded Analytics
by Kalar Rajendiran on 09-02-2021 at 6:00 am

Tessent Embedded Analytics Architecture

The foundry model, multi-source IP blocks, advanced packaging technologies, cloud computing, hyper-connectivity and access to open-source software have all contributed to the incredible electronics products of recent times. Along with this, the complexity of developing and taking a chip to market has also increased. And… Read More