To me this is going to be one of the bigger Chicken Little moments in the history of semiconductors. Mostly because we are now a click driven society and the media is plagued by so called influencers that live and die by clicks. In my 40+ years as a semiconductor professional I have witnessed many of these Chicken Little moments with … Read More
How to Overcome the Advanced Node Physical Verification BottleneckIt is well-known that advanced semiconductor process technology…Read More
proteanTecs at Chiplet Summit – Changing the Game for Health & Performance Monitoring of ChipletsThe recent Chiplet Summit 2026 was a great…Read More
WEBINAR: Intrinsic Techniques in RF Power Amplifier DesignLoad-pull power amplifier (PA) design techniques determine the…Read More
Analog Bits Demos Real-Time On-Chip Power Sensing and Delivery on N2P at the TSMC 2026 Technology SymposiumAnalog Bits has a way of stealing the…Read MoreTwo Paths for AI in Semiconductor Manufacturing: Platform Integration vs. Point Solutions
Semiconductor manufacturing has become one of the most data-intensive industrial environments in the world, and AI is rapidly becoming central to how fabs operate and optimize. Yet, rather than converging on a single model for AI adoption, the industry is evolving along two distinct paths. One centered on platform-scale… Read More
Carbon in the Age of AI Chips: What the Semiconductor Industry Needs to Know This Earth Day
Stephen Russell: Senior Technical Fellow, TechInsights
Every April, Earth Day prompts a flurry of corporate sustainability pledges and green-tinted press releases. But for the semiconductor industry in 2026, the conversation has moved well past pledges. Carbon accountability is now a procurement requirement, a regulatory… Read More
TSMC Technology Symposium 2026 Overview
Yes, it is that time of year again, the 2026 TSMC Technology Symposium kick-off event in Silicon Valley. TSMC has never been in a better position to forecast the future of semiconductor technology and the industry itself. TSMC closely collaborates with the top semiconductor companies around the world and the top players in the … Read More
Could Neutral Atoms Take the Lead in Quantum Computing?
As of my recent posts on quantum computing (QC), superconducting QC is the leading technology contender, exemplified in systems from IBM, Google, and Fujitsu. Other technologies such as ion trap, neutral atom, photonic and quantum dot have generally been viewed as intriguing but second tier. I just read a very recent paper suggesting… Read More
Transitioning Voltage Regulator Design From Unidirectional To Bidirectional
An interesting article by Nazzareno Rossetti, published in How2Power Today, explores the transition from designing traditional unidirectional voltage regulators to bidirectional converters essential for modern energy management systems (EMSs). These systems optimize energy flow and storage among electric vehicles,… Read More
How to Overcome the Advanced Node Physical Verification Bottleneck
It is well-known that advanced semiconductor process technology presents substantial challenges across the full design flow and global supply chain. In this piece, we will focus on a particularly difficult problem – physical verification. This design step is the final gate to manufacturing. Producing a final tape‑out GDS … Read More
Is Intel About to Take Flight?
The Pan Am–Boeing playbook and what Musk’s Terafab order could mean for Intel Foundry
“We either build the Terafab or we don’t have the chips.” That’s Elon Musk, speaking to Reuters, stating a supply constraint as plainly as anyone has stated one. TSMC is sold out. Samsung is committed. The existing supply chain can’t expand fast… Read More
proteanTecs at Chiplet Summit – Changing the Game for Health & Performance Monitoring of Chiplets
The recent Chiplet Summit 2026 was a great place to learn about new chiplet designs, emerging standards, and a growing array of support technologies to help design and manufacture chiplet-based systems. In my travels at the show, I found a lot of technology that fit these descriptions. But there were also companies at the show that… Read More
WEBINAR: Intrinsic Techniques in RF Power Amplifier Design
Load-pull power amplifier (PA) design techniques determine the optimal impedances at the power transistor’s extrinsic reference plane, which is the physically accessible boundary for measurement or simulation. This reference plane can be the package transistor leads, die bond pads, or IC chip terminals. It includes… Read More



Is Intel About to Take Flight?