The RISC-V and Open-Source Functional Verification ChallengeMost of the RISC-V action at the end…Read More
Sarcina Democratizes 2.5D Package Design with Bump Pitch Transformers2.5D package design is rapidly finding its stride…Read More
Addressing Reliability and Safety of Power Modules for Electric VehiclesAs electric vehicles (EVs) gain widespread adoption, safety,…Read More
Shaping Tomorrow’s Semiconductor Technology IEDM 2024Anyone who has read my articles about IEDM…Read More
SI and PI Update from Cadence on Sigrity XSignal Integrity (SI) and Power Integrity (PI) issues…Read More
When Intel entered the foundry business with IDM 2.0 I was impressed. Yes, Intel had tried the foundry business before but this time they changed the face of the company with IDM 2.0 and went “all-in” so to speak. The progress has been impressive and today I think Intel is well positioned to capture the NOT TSMC business by providing… Read More
I generally like to start my blogs with an application-centric viewpoint; what end-application is going to become faster, lower power or whatever because of this innovation? But sometimes an announcement defies such an easy classification because it is broadly useful. That’s the case for a recent release from Quadric, based… Read More
Dan is joined by Clay Johnson, CEO of CacheQ. Clay has decades of executive experience in computing, FPGAs and development flows, including serving as Vice President of the Xilinx Spartan Business Unit which was acquired by AMD.
Clay discusses the changes occurring in system design to leverage AI/ML and technologies such as large… Read More
Orr Danon is the CEO and Co-Founder of Hailo. Prior to founding Hailo, Orr spent over a decade working at a leading IDF Technological Unit. During this time he led some of the largest and most complex interdisciplinary projects in the Israeli intelligence community. For the projects he developed and managed, Danon received the … Read More
Is it time to abandon the ASML stock?
The first tool company to report Q2-24 results is ASML, and the lithography leader delivered a result above the guidance of EUR5.95B. Revenue of EUR6.242B is 4.9% above guidance and 18% above last quarter’s result of EUR5.29B.
Both operating profit and gross profit grew but not to the level of … Read More
At #61DAC, I love it when an exhibitor booth uses a descriptive tagline to explain what they do, like when the Blue Cheetah booth displayed Advancing Chiplet Interconnectivity. Immediately, I knew that they were an IP provider focusing on chiplets. I learned what sets them apart is how customizable their IP is to support specific… Read More
As AI and 5G technologies burgeon, the rise of interconnected devices is reshaping everyday life and driving innovation across industries. This rapid evolution accelerates the transformation of the chip industry, placing higher demands on SoC design. Moore’s Law indicates that while chip sizes shrink, the number of… Read More
#61DAC was buzzing with discussion of chiplet-based, heterogeneous design. This new design approach opens new opportunities for applications such as AI, autonomous driving and even quantum computing. A critical enabler for all this to work is reliable, cost-effective advanced packaging, and that is the topic of this post.… Read More
An under-appreciated but critical component in signing off the final stage of chip design for manufacture is timing closure – aligning accurate timing based on final physical implementation with the product specification. Between advanced manufacturing processes and growing design sizes, the most important factors determining… Read More
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