wide 1

Podcast EP139: The Third Quarter ESDA Market Data Report with Dr. Walden Rhines

Podcast EP139: The Third Quarter ESDA Market Data Report with Dr. Walden Rhines
by Daniel Nenni on 01-23-2023 at 8:00 am

Dan discusses the recent Q3 2022 ESDA report with Wally Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. While not tracking the record-breaking growth that has been seen over the past few quarters, growth is generally quite strong across the world. Dan explores the numbers with Wally, including some… Read More


Samtec Dominates DesignCon (Again)

Samtec Dominates DesignCon (Again)
by Mike Gianfagna on 01-23-2023 at 6:00 am

Samtec Dominates DesignCon Again

Many technical shows have anchor tenants. Those are the companies that can be counted on to have a substantial booth presence, be active in the technical program and just pump life into the event at every turn. Samtec is that company for many shows around the world. And soon it will be time for them to work their magic at DesignCon in … Read More


Podcast EP138: The Impact of Using a Physically Aware NoC with Charlie Janac

Podcast EP138: The Impact of Using a Physically Aware NoC with Charlie Janac
by Daniel Nenni on 01-20-2023 at 10:00 am

Dan is joined by Charlie Janac, president and CEO of Arteris IP. Charlie’s career spans 20 years in multiple industries, including design automation, semiconductor capital equipment, nanotechnology, industrial polymers, and venture capital.

Charlie discusses the benefits of using network-on-chip, or NoC IP on several… Read More


CEO Interview: Stephen Fairbanks of Certus Semiconductor

CEO Interview: Stephen Fairbanks of Certus Semiconductor
by Daniel Nenni on 01-20-2023 at 6:00 am

Stephen Fairbanks headshot 1 1

Trained as a semiconductor Analog and RF Circuit Designer, Stephen Fairbanks has been designing and developing process-specific I/O and ESD libraries for 24 years. His foundational training began while attending Brigham Young University designing highspeed 32 GSPS data acquisition systems and RF interfaces for a time-of-flight… Read More


ATSC 3.0: Sleeper Hit of CES 2023

ATSC 3.0: Sleeper Hit of CES 2023
by Roger C. Lanctot on 01-19-2023 at 10:00 am

ATSC 3.0 Sleeper Hit of CES 2023

Ten years ago the Open Mobile Video Coalition was touting its plans to deliver free over-the-air television to mobile devices and automobiles. At the time, OMVC was seen as the realization of a dream of delivering video to cars – front seat and back.

The dream didn’t last long and the plans for ATSC M/H brought to the market by the OMVC… Read More


ZoneCast Blast Misses Its Mark

ZoneCast Blast Misses Its Mark
by Roger C. Lanctot on 01-19-2023 at 6:00 am

ZoneCast Blast Misses Its Mark

On my flight to Las Vegas for the annual Consumer Electronics show I dug in to Jeff Smulyan’s autobiographical “Never Ride a RollerCoaster Upside Down – The Ups and Downs and Reinvention of an Entrepreneur.” As CEO, Chairman, and Founder of Emmis Communications Smulyan has had a front row seat to the evolution of the electronics… Read More


2022 Retrospective. Innovation in Verification

2022 Retrospective. Innovation in Verification
by Bernard Murphy on 01-18-2023 at 10:00 am

Innovation New

As usual in January we start with a look back at the papers we reviewed last year. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and now Silvaco CTO) and I continue our series on research ideas. As always, feedback welcome. And don’t forget to come see us at DVCon,… Read More


IEDM 2022 – Imec 4 Track Cell

IEDM 2022 – Imec 4 Track Cell
by Scotten Jones on 01-18-2023 at 6:00 am

2022 IEDM Presentation Session23 2 VictorVega Page 03

At the IEDM conference in December 2022, Imec presented “Semi-damascene Integration of a 2-layer MOL VHV Scaling Booster to Enable 4-track Standard Cells,” I had a chance to not only read the paper and see it presented, but also to interview one of the authors Zsolt Tokie.

Logic designs are built up by standard cells such as inverters,… Read More


Application-Specific Lithography: Sub-0.0013 um2 DRAM Storage Node Patterning

Application-Specific Lithography: Sub-0.0013 um2 DRAM Storage Node Patterning
by Fred Chen on 01-17-2023 at 10:00 am

Application Specific Lithography 1

The pursuit of ever smaller DRAM cell sizes is still active and ongoing. DRAM cell size is projected to approach 0.0013 um2 for the D12 node. Patterning challenges are significant whether considering the use of DUV or EUV lithography. In particular, ASML reported that when center-to-center values reached 40 nm, single patterning… Read More


Alphawave IP is now Alphawave Semi for a very good reason!

Alphawave IP is now Alphawave Semi for a very good reason!
by Daniel Nenni on 01-17-2023 at 6:00 am

datacenter technology sq

The semiconductor ecosystem has been full of interesting twists of late and Alphawave has been a company to watch since the very beginning. Alphawave came out of stealth mode in early 2019 as the world’s first IP company focused on multi-standard connectivity (SerDes) IP solutions. The importance of SerDes had been understated… Read More