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Most of the RISC-V action at the end of June was at the RISC-V Summit Europe, but not all. In fact, a group of well-informed and opinionated experts took over the Pavilion stage at the Design Automation Conference to discuss functional verification challenges for RISC-V and open-source IP.
Technology Journalist Ron Wilson and … Read More
2.5D package design is rapidly finding its stride in a wide variety of applications, including AI. While there are still many challenges to its widespread adoption, the chiplet approach is becoming more popular compared to monolithic design. However, the required market to create a chiplet ecosystem is still under development.… Read More
As electric vehicles (EVs) gain widespread adoption, safety, reliability, and efficiency are becoming increasingly important. A crucial component in ensuring these aspects is the power module (PM), which manages the energy flow between the EV battery and the motor. The design of these power modules must not only meet the high-performance… Read More
Anyone who has read my articles about IEDM in the past know I consider it a premiere conference covering developments of leading-edge semiconductor process technology. The 2024 conference will take place in San Francisco from December 7th through 11th.
Some highlight of this year’s technical program are:
AI – Lots of artificial… Read More
Signal Integrity (SI) and Power Integrity (PI) issues are critical to analyze, ensuring the proper operation of PCB systems and IC packages, yet the computational demands from EDA tools can cause engineers to only analyze what they deem are critical signals, instead of the entire system. Cadence has managed to overcome this SI/PI… Read More
You might think that in the sensing world all the action is in imaging and audio is a backwater. While imaging features continue to evolve, audio innovations may be accelerating even faster to serve multiple emerging demands: active noise cancellation, projecting a sound stage from multiple speakers, 3D audio and ambisonics,… Read More
As chip design complexity increases, integration scales expand and time-to-market pressures grow, as a result, design verification has become increasingly challenging. In multi-FPGA environments, the complexity of design debugging and verification further escalates, making it difficult for traditional debugging methods… Read More
The TSMC Open Innovation Platform (OIP) Ecosystem Forum has become the industry benchmark when it comes to showcasing industry-wide collaboration. The extreme design, integration and packaging demands presented by multi-die, chiplet-based design have raised the bar in terms of required collaboration across the entire … Read More
Dan is joined by Kevin Robinson, yieldHUB’s Vice President of operations and sales. With over 23 years of experience as a test engineer in the semiconductor industry, Kevin brings a wealth of knowledge and dedication to his dual role. At yieldHUB, Kevin leads both sales and operations teams, playing a crucial role in delivering… Read More
Mehdi is a serial entrepreneur with a track record of success. He is currently CEO and co-founder of SiLC. SiLC is his third Silicon Photonics start up focusing on advanced imaging solutions that enable machines to see like humans. His previous start up, Kotura where he was CTO and SVP of Engineering, developed communication solutions… Read More
CES 2025 and all things Cycling