TSMC’s AI Design Kit: Bringing Agentic AI Into Chip DesignTSMC is introducing an AI Design Kit, or…Read More
OpenAI and Synopsys Announce GPT-Synopsys: Why AI-Powered Chip Design MattersWow, OpenAI and Synopsys just announced a multiyear…Read More
Why the energy sector must plan for post-quantum cyber security nowIn a September 2026 World Economic Forum article,…Read More
TSMC OIP Ecosystem Forum 2026: Broadcom’s View of ASICs and EcosystemsI spent a significant part of my career…Read More
The Pivotal Moments That Gave Rise to Silicon ValleyThe little-known decisions and breakthroughs—and the remarkable role…Read More
In advanced packaging, warpage is rarely a modeling problem. It is a timing problem.
JOHN BRUGGEMAN
By the time many advanced packages undergo high-fidelity thermo-mechanical analysis, a long chain of decisions has already been made. Stackup. Materials. Die placement. Package architecture. Each decision constrains the … Read More
Signoff-quality design tools are mandatory for signoff, though not so good for early design exploration. Signoff demands high accuracy in design description and high precision in analysis. The first requirement can’t be met early in design where architecture decisions are still in flux, and the second depends on very detailed… Read More
Modern ASIC, SoC, CPU, and GPU development depends on verification processes that detect subtle functional defects before tapeout. SystemVerilog Assertions (SVA) are particularly important because they encode temporal design intent: how signals, states, and transactions must behave across clock cycles. Unlike conventional… Read More
RISC-V has evolved from a Berkeley research architecture into a global instruction-set standard spanning embedded controllers, application processors, accelerators, and emerging servers. Its defining technical characteristic is not merely openness, but disciplined modularity. Four ratified base ISAs—RV32I, RV64I,… Read More
Artificial intelligence performance is increasingly constrained by memory rather than arithmetic throughput. Scaling laws show that model quality improves when parameter count, training data, and compute grow together, but this balance fails when processors cannot obtain operands quickly enough. Contemporary accelerators… Read More
Cloud-based EDA has been around for awhile now, so at #DAC2026 I met with Vikram Bhatia, Executive Director of Synopsys Cloud to see what’s new with their offering. His background includes stints at Sun, IBM, Microsoft, HP, Oracle and NetApp. The Synopsys Cloud FlexEDA lets designs teams run their EDA solutions inside of a web browser,… Read More
SiFive is bringing RISC-V closer to mainstream datacenter deployment with the BigSky SF-2U870, an enterprise-grade development server designed for hyperscalers, semiconductor companies, software vendors, and ecosystem partners. Announced in Santa Clara on August 24, 2026, alongside Hot Chips, the rackable 2U platform… Read More
Here’s what the presentations selected for the 2026 Hot Chips Conference tell us about what Silicon Valley companies are doing these days.
The conference, running this week at Stanford’s Memorial Auditorium, doesn’t publish detailed abstracts ahead of time, but the program itself, just the lineup of who’s presenting what, … Read More
Daniel is joined by Dr. Cedric Huyghebaert, CTO of Black Semiconductor. Cedric is one of the world’s leading experts in the development and integration of 2D materials, particularly graphene, into industrial semiconductor manufacturing. With a PhD in Physics from KU Leuven and over 25 years at imec, Cedric built and led… Read More
TSMC’s photonics strategy is centered on integrating optical input-output with advanced logic, rather than selling conventional optical transceivers as standalone products. The company is developing a silicon-photonics foundry platform and a packaging architecture called TSMC-COUPE, or Compact Universal Photonic … Read More
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Intel Foundry: AI performance now depends on the whole system