The global semiconductor market grew 25% in the 1st quarter of 2026 from the 4th quarter of 2025 to reach $299 billion, according to WSTS. The 1st quarter of 2026 was up 79% from a year earlier. The 25% quarter-to-quarter growth was the highest in the over 40-year history of WSTS data, surpassing the 20% growth in the 2nd quarter of 2009.… Read More
Demonstrating the EasyAI ECO Suite – An AI-Powered Functional ECO Solution at DAC 2026Easy-Logic, a leading provider of high-performance Engineering Change…Read More
The Accidental Infrastructure: How Crypto Miners Built the Foundation of the AI BoomMost crypto forty-niners died broke in a warehouse…Read More
From Detection to Safety: Reframing Fault Simulation for Functional SafetyIn the early 1980s, when computer-aided engineering (CAE),…Read More
Driving the Future through the “Talent Empowering Program”: Why TSMC Charity Foundation’s Youth Career Initiative MattersThe future of work will not be shaped…Read More
Foundation IP for Intel 18A: Technical Overview and Why It MattersSynopsys Foundation IP for Intel 18A is a…Read MoreBronco AI Webinar: Full-Chip SoC Debug in 15 Minutes
A single bug on a full-chip SoC can pull engineers off roadmap work for days or even weeks. It involves massive waveforms, thousands of files of RTL and UVM, and dense specs that aren’t always perfect. Finding these bugs have always been a matter of engineer-hours and how well knowledge diffuses through the organization.
Bronco … Read More
Europe is Getting Serious About ASIC Innovation
I was born in the UK (then still a part of Europe), so always eager to see them succeed. But I must admit that past behavior has reinforced the view that the EU’s only active “contribution” to progress is regulation. However this seems to be changing in multiple interesting ways. On a grand scale, the Nordic economic model is taking … Read More
Siemens EDA Expands AI and Advanced Packaging Collaboration with TSMC
At the recent TSMC Technology Symposium 2026, Siemens EDA reinforced its position as one of the key ecosystem partners supporting TSMC in the race toward AI-driven semiconductor design, advanced packaging, and next-generation process technologies. The annual forum has become one of the semiconductor industry’s most important… Read More
Semidynamics Secures a Strategic Investment to Advance Memory-Centric AI Inference Chips
In the rapidly evolving world of artificial intelligence hardware, memory bandwidth and data movement have become just as important as raw compute power. Addressing this challenge head-on, Semidynamics has announced a strategic investment aimed at accelerating the development of its next-generation memory-centric AI … Read More
Quantum Gathering Momentum Amid Concerns for the Grid
I posted recently on an eye-catching advance in quantum computing, around neutral atom systems which might accelerate the transition to production-grade fault-tolerant quantum computing (QC). There are some further updates on this front, also I listened in on a panel considering quantum-based hacking vulnerability in the… Read More
PQShield unveils ultra-small PQC embedded security breakthroughs at Embedded World 2026
As the threat of quantum computing to modern cybersecurity becomes increasingly real, the technology industry is accelerating efforts to develop cryptographic systems capable of resisting quantum attacks. One of the most significant developments in this field was presented at Embedded World 2026 in Nuremberg, Germany, … Read More
Closing the Silicon Realization Gap: From Static DFM to Governance for Lifecycle (GFL)
The semiconductor industry has achieved extraordinary mastery in silicon signoff. Modern EDA environments can now optimize timing closure, physical verification, IR/EM behavior, routing density, thermal interaction, and increasingly even design-space exploration through AI-assisted implementation flows. Crossing… Read More
imec IC-Link and TSMC 3DFabric Alliance Expansion Signals New Era of System-Level Scaling
imec announced that IC-Link by imec has joined the TSMC 3DFabric Alliance, a strategically important move that reflects the semiconductor industry’s transition from traditional monolithic scaling toward heterogeneous integration, chiplet architectures, and advanced packaging-driven system optimization. The partnership… Read More
Crossing the Yield Cliff: IDP V6 and the Future of Manufacturing Forecasting
The paper, Industrial Defectivity Prediction (IDP) V6: A Two-Layer Yield Cliff Framework for Cross-Industry Mass-Production Forecasting, presents a generalized industrial yield-modeling architecture that extends the classical Negative Binomial framework through a two-layer phenomenological structure designed … Read More


Consolidation and Competition: Who is Winning the $4.5 Billion Interface IP Race?