800x100 static WP 3

RD Pathfinding Process Engineer (Front-end Module Pathfinding)

RD Pathfinding Process Engineer (Front-end Module Pathfinding)
by Admin on 05-28-2020 at 8:28 pm

Website TSMC

Description

EPI

  • Advanced epi module process development and baseline sustaining
  • Epi process stability/manufacturability improvement for yield and reliability qualification
  • Epi process/tool transfer to volume manufacturing

Metal

  • Advanced metal/ contact module process development and baseline sustaining
  • Advanced metal/ contact tool development and optimization
  • Metal/ contact process stability/manufacturability improvement for yield and reliability qualification
  • Metal/ contact process/tool transfer to volume manufacturing

III. Thin Films

Advanced thin films development. deployment & delivery

Gate Stack/CMP

  • Advanced gate stack (high-k/metal gate) module process and new material development
  • Advanced chemical mechanical polishing (CMP) module process and new slurry development

Etch

  • Develop critical etch process with innovations for advanced nodes (plasma or chemical etch)
  • Evaluate new tool, new chemical or gas, new material, or new process approach to enable transistor scaling.

Qualifications

  • Having passion on understanding process fundamentals, endurance for challenging path-finding tasks and innovative mind for finding best solutions.
  • Proven record of advanced node process development, IC process module development and tool design is a plus.
  • Hands-on experience of material characterizations and in-line metrology is a plus.
  • MS or Ph.D. in Chemical Engineering, Material Science, Chemistry, Physics, Electrical engineering (solid states or optoelectronics) or a related engineering discipline.
  • Excellent written and spoken communication skills is required.
Apply for job

To view the job application please visit tsmc.taleo.net.

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