The Common Platform Alliance — IBM, Samsung Electronics, Co., Ltd., and GLOBALFOUNDRIES — continues to redefine the landscape of the semiconductor industry with its groundbreaking collaboration. Join us at our 2013 Common Platform Technology Forumon Tuesday, February 5, 2013 at the Santa Clara Convention Center as we showcase the latest technological advances being delivered to the world’s leading electronics companies.
Real Collaboration = Big Business
At the Common Platform Technology Forum, you’ll see and hear firsthand how the combined expertise of our partners is addressing the most demanding IC design and manufacturing challenges. Our collaborative research and innovative technology development have resulted in an accelerated roadmap and rapid customer adoption, and we’ll touch upon these key highlights:
[*=left]Leading-edge process technologies at 32/28-, 20-, 14-, and 10 nanometer
[*=left]Advanced innovations such as FinFET, design & technology co-optimization, and double patterning
[*=left]A peek into the future of next-generation device innovations being researched: silicon nanowires, carbon nanotubes, and 3D device structures
[*=left]A showcase of our ecosystem partners and Common Platform design, enablement, and implementation offerings in our Partner Pavilion
And, visionary keynotes by IBM, Samsung, GLOBALFOUNDRIES, and ARM.
Register now for this FREE technical event!
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