Tears in the Rain – Arm and China JVs

Tears in the Rain – Arm and China JVs
by Jay Goldberg on 07-03-2020 at 10:00 am

Tears in the Rain – Arm and China JVs

We always warn clients that even in the best of times, Joint Ventures (JVs) in China always end in tears. And we are far from the best of times right now. There is a major example of this playing out right now with Arm China.

Arm’s China JV is, to put it simply, a bit of a mess. The Board has fired the CEO, but he has refused to leave. And owing… Read More


China’s Position in the Global Semiconductor Value Chain

China’s Position in the Global Semiconductor Value Chain
by Bart van Hezewijk on 05-25-2020 at 6:00 am

China Semiconductor SemiWiki

In this third article about China’s role in the global semiconductor industry I analyse the current state of affairs of the Chinese semiconductor industry in different segments. In the previous articles, I looked at the possible effects of a US-China decoupling in the semiconductor industry and the impact of the Big Read More


DFT Innovations Come from Customer Partnerships

DFT Innovations Come from Customer Partnerships
by Tom Simon on 05-05-2020 at 10:00 am

Mentro Tessent Innovation

There is an adage that says that quality is not something that can be slapped on at the end of the design or manufacturing process. Ensuring quality requires careful thought throughout development and production. Arguably this adage is more applicable to the topic of Design for Test (DFT) than almost any other area of IC development… Read More


Full Solution for eMRAM Coming in 2020

Full Solution for eMRAM Coming in 2020
by Tom Simon on 12-19-2019 at 6:00 am

Trimming for eMRAM in Tessent

It’s amazing to think that Apollo moon mission used computers that were based on magnetic core memories. Of course, CMOS memories superseded them rapidly. However, over the decades since, memory technologies have advanced significantly, in terms of density, power and new types of technologies, e.g NAND Flash. Ever since the… Read More


Intel vs AMD vs Google vs Amazon vs NUVIA

Intel vs AMD vs Google vs Amazon vs NUVIA
by Daniel Nenni on 11-29-2019 at 6:00 am

Arguably the cloud was the quickest road to riches for chip designers large and small. As an emerging company, if you wanted to raise money just put “Datacenter” in your pitch deck and you were assured millions. You would be competing with semiconductor’s version of David and Goliath (AMD and Intel) but that was a good thing, right?… Read More


Cadence Shows off 5LPE Hercules Implementation

Cadence Shows off 5LPE Hercules Implementation
by Randy Smith on 10-28-2019 at 10:00 am

In a joint presentation given by Samsung, Arm, and Cadence at the Arm TechCon event on October 9, 2019, Cadence showed some results and explained its collaboration project used to implement the new Arm Hercules CPU on Samsung’s advanced 5LPE process. I do not want to minimize the significance of Samsung’s and Arm’s participation… Read More