Thursday, May 30, 2024 | 10:00-11:00 a.m. PDT Many automotive applications require processing workloads with minimum latency and precise timing budgets. This is especially true for safety-critical applications like adaptive …
Today’s advanced node chip designs are faced with many new complexities which require more verification, more validation and more analysis. The resulting data from these added steps has also grown exponentially and engineers need a way to efficiently analyze this information. The result is a new paradigm shift which has led to data overload requiring …
Be sure to register for this high tech security webinar. You’ll learn how to identify threat scenarios quickly and why a model-based, system-oriented solution is needed to protect your hardware. TIME: JUNE 5, 2024 9 AM EDT / 3 PM CEST / 6:30 PM IST Venue: Virtual Overview Connected vehicles offer a range of benefits, …
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Webinar Content Perception sensors are the backbone of most adaptive systems, e.g. autonomous vehicles, robots, industrial automation or quality control systems. In this webinar you will get an overview of common sensor principles, such as (stereo)-camera, lidar, radar, ultrasonic, as well as established processing algorithms. We will look at how to efficiently prototype perception sensor …
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Summary The most advanced and successful Automotive manufacturers rely on model-based systems engineering in their journeys towards software defined vehicles. Model-based engineering (MBE) facilitates the digital thread by linking designs to stakeholder and system requirements, enabling seamless trace chains. MBE is the foundation for a common systems model, connecting stakeholders and domains. Join us for …
This webinar showcases the workflow of using Ansys Maxwell, HFSS, and Ansys SimAI for electromagnetic field training and prediction. This combination transforms the design and analysis of electromagnetic components by reducing the field prediction time by tens to hundreds of times. Time: June 11, 2024 10 AM EDT Venue: Virtual Overview Electromagnetic devices are everywhere …
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Ansys ConceptEV is a new innovative cloud-based design and simulation platform for the design of EV powertrains. Engineers can collaborate on a shared system simulation connected to requirements from the start of the design process. Don't miss this upcoming webinar. TIME: JUNE 11, 2024 11 AM EDT / 5 PM CEST Venue: Virtual Overview Ansys …
We are holding a FREE virtual workshop course for automotive OEM, suppliers and semiconductor industry professionals who want to better understand the software solutions available to help them comply with ISO26262 when going from chip to vehicle system. TIME: JUNE 11, 2024 10 AM EDT - 4 PM EDT Venue: Virtual Overview This course will …
Designing a small but high-capacity EV battery pack presents a complex set of challenges. The key to solving these challenges is efficient battery temperature and load management that addresses the entire battery system. In this webinar, you will learn how digital twins: Combine multiple physical domains to show the complex system response of a battery …
Ansys Semiconductor Manufacturing Webinar Series: Part 3 of 3. Join us on Thursday, June 13th for an in-depth discussion on addressing sustainability challenges in complex manufacturing processes. Learn more about the …
Additive Manufacturing (AM) adoption within the automotive industry has rapidly increased in the past few decades. Growing demand for sustainable fuels and electric mobility have been some of the drivers for rapid AM adoption. These technologies can improve efficiency and significantly reduce mass. Automotive companies have found multiple applications, including prototypes, tooling, and parts with …
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Join us for an insightful webinar where we dive deeper into how Ansys STK, ModelCenter and the Systems Architect Model (SAM) revolutionize digital engineering and MBSE practices. Discover how these powerful tools can significantly reduce design time and optimize tradeoffs. TIME: JUNE 14, 2024 11 A.M. EDT Venue: Virtual Overview Join us for an insightful …
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Multiple Sessions - All English Language: 14:00 JST (APAC) 10:00 EDT, 16:00 CET (AMER and EUR) Stacking multiple dies with 3D ICs offer enhanced functionality, reduced form factor, and improved interconnect density. However, these advancements come with several challenges, including thermal management issues. Multiphysics suites from Altair assist designers in optimizing thermal management strategies and …
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