UK Innovation Conference

The MTC, Coventry Ansty Park, The Manufacturing Technology Centre, Coventry, United Kingdom

The 2024 UK Innovation Conference Building on the success of the 2023 edition, this year's event is set to be bigger and better than ever. With industry-leading keynote speakers, top plenary sessions, increased networking opportunities, and industry and application tracked sessions, join us to uncover what's possible through simulation. Gain insight into Ansys' simulation strategy …

Ansys Speos + DXOMARK Analyzer Revolutionize Virtual Camera System Validation

Online

Ansys Speos is collaborating with DXOMARK Analyzer, a leading tool for image quality analysis, to revolutionize the validation process of virtual camera systems. This webinar introduces the end-to-end camera solution that integrates physical measurements with simulation. Join us to explore this groundbreaking partnership and learn how it can transform how you assess virtual camera system …

Webinar: Secure the Right Permanent Magnet Latching System in Portable Devices

Online

Tablets, smartphones, watches, and virtual reality devices utilize permanent magnets. Accessories such as a stylus, wireless charging transmitters, and earbuds attach to them with a magnetic latching force. It is critical to understand the magnetic fields and forces from PMs of different sizes, shapes, and grades and to study the influence of ferromagnetic shunts, magnetization, …

Webinar: Demystifying Light: Ansys SPEOS for Optical Lightguides

This course will be held Online

Ever wondered how light travels within a device? This Rand Simulation webinar will be your guide to understanding and designing optical lightguides using Ansys SPEOS. We'll explain the fundamentals of SPEOS and explore its capabilities for simulating light behavior in lightguides. Join us on Wednesday, May 22 at 2 PM ET and discover how we …

Webinar: Reducing Semiconductor Packaging Defects with Ansys Tools

Online

Ansys Semiconductor Manufacturing Webinar Series: Part 2 of 3. Join us on Thursday, May 23rd for an in-depth discussion on reducing defects in the semiconductor packaging process. Learn more about the webinar series! TIME: THURSDAY, MAY 23, 2024 11 AM EASTERN TIME Venue: Virtual Overview Semiconductor packaging involves integrating heterogeneous chips with different functionalities into a …