Packaging Failure and Yield Analysis

Penang, Malaysia Penang, Malaysia

Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of …

MLCAD Symposium 2024

Snowbird, Utah 9385 Snowbird Center Trail, Snowbird, UT, United States

6th ACM/IEEE International Symposium on Machine Learning for CAD September 9-11, 2024 in Snowbird, Utah! Important Announcements Student travel grants: We are pleased to offer several travel grants to students. Read …

DVCon Taiwan

Hsinchu, Taiwan Hsinchu, Taiwan

Welcome Message On behalf of the DVCon Taiwan 2024 steering committee, it is my honor to welcome you all to the second edition of the Design and Verification Conference in …

COMVEC 2024

Schaumburg, Illinois Schaumburg, IL, United States

Improving Commercial, Software Defined Vehicles COMVEC™ returns to Schaumburg, IL, in 2024! We are in the fast lane, driving toward a software-defined future. The commercial vehicle industry must come together to exchange …

SEMICON India 2024

India Expo Mart (IEML) 25-29, Knowledge Park II, Greater Noida, Uttar Pradesh, India

Please save the date for India’s premier semiconductor event, the inaugural SEMICON India 2024, September 11-13, in New Delhi. Co-located with electronica India and productronica India, the exhibition and conference …