Check out the latest updates to Ansys Fluent GPU Solver in 2024 R2, including additional hardware support, new physics, and simulation environment improvements in this upcoming webinar. TIME: September 4, …
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Introducing Ansys Access on Microsoft Azure, a newly released option that streamlines your transition to the cloud. This solution allows a hybrid approach, enabling you to offload heavy workloads to …
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Ansys introduces Ansys TwinAI, a new addition to Ansys Digital Twin's product portfolio that seamlessly integrates the accuracy of physics models with insights from real-world data powered by cutting-edge AI/ML techniques in this upcoming webinar. TIME: September 5, 2024 Venue: Virtual Overview Ansys launched Ansys 2024 R2, which extends its digital twin offering in multiple …
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Join this webinar for the latest updates on virtual engineering simulation capabilities in the primary and secondary packaging domain. Showcasing physics-based 3D simulation for performance insight during storage, transportation, and manufacture. Date: Thursday, September 5, 2024 Time: 15:00 BST, 16:00 CEST, 10:00 EDT Venue: Online Questions Should you have any questions please contact uk-marketing@ansys.com About this …
Power-Efficient RISC-V, DSP and NPU IP for Your Diverse SoC Processing Needs As electronic systems continue to become more complex and integrate greater functionality, SoC developers are faced with the …
We are holding a FREE virtual workshop course for automotive OEM, suppliers and semiconductor industry professionals who want to better understand the software solutions available to help them comply with ISO26262 when going from chip to vehicle system. TIME: SEPTEMBER 5, 2024 9:30 AM – 4:30 PM CET Venue: Virtual Overview This course will combine lectures …
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ChipQuest Webinar Join us for an exclusive 1-hour webinar designed for HR and Learning & Development professionals in the US semiconductor industry. This event will delve into the pressing workforce …
Continue reading "Webinar: Workforce Armageddon is here. Will your fab survive? Or thrive?"
Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of …
6th ACM/IEEE International Symposium on Machine Learning for CAD September 9-11, 2024 in Snowbird, Utah! Important Announcements Student travel grants: We are pleased to offer several travel grants to students. Read more. Journal special issue: Following MLCAD 2024, you will be invited to submit an expanded version. Read more. Open peer review: MLCAD will be using OpenReview starting this year. Read …
The AI Hardware & Edge AI Summit is the ultimate destination for the entire AI and ML ecosystem, with a collaborative mission to train, deploy and scale machine learning systems that are …
Welcome Message On behalf of the DVCon Taiwan 2024 steering committee, it is my honor to welcome you all to the second edition of the Design and Verification Conference in Taiwan. The 1st DVCon has been held successfully in 2023. DVCon Taiwan 2024 will be held at Amazing Hall, with RISC-V Taipei Day on September …
Improving Commercial, Software Defined Vehicles COMVEC™ returns to Schaumburg, IL, in 2024! We are in the fast lane, driving toward a software-defined future. The commercial vehicle industry must come together to exchange ideas, get up to date on research and technology, and tackle challenges — so the world can continue to depend on us. SAE International’s COMVEC™ …
