The International Workshop on Hardware and Architectural Support for Security and Privacy (HASP) 2024

AT&T Hotel and Conference Center 1900 University Avenue, Austin, TX, United States

Call for Papers Although much attention has been directed to the study of security at the system and application levels, security and privacy research focusing on hardware and architecture aspects is still a new frontier. In the era of cloud computing, smart devices, and novel nano-scale devices, practitioners and researchers have to address new challenges …

MICRO 2024 (57th IEEE/ACM International Symposium on Microarchitecture®)

AT&T Hotel and Conference Center 1900 University Avenue, Austin, TX, United States

The IEEE/ACM International Symposium on Microarchitecture® is the premier forum for presenting, discussing, and debating innovative microarchitecture ideas and techniques for advanced computing and communication systems. This symposium brings together researchers in fields related to microarchitecture, compilers, chips, and systems for technical exchange on traditional microarchitecture topics and emerging research areas. The MICRO community has enjoyed a …

APCCAS 2024

CHANG YUNG-FA FOUNDATION International Convention Center (CYFF) No.11, Zhongshan S. Rd., Taipei City, Taiwan

The APCCAS is a major international forum for researchers, scientists, educators, students and engineers to exchange their latest findings in circuits and systems. It covers a wide range of topics …

WT | The Wearable Technologies Show 2024

Düsseldorf, Germany Düsseldorf, Germany

A must for anyone who is entering the medical market of wearables The world's biggest medical trade fair is the hotspot for wearable technologies in the healthcare segment where decision-makers from all over the world come together. At the WT | Wearables Technologies Joint Pavilion more than 45 exhibitors are showcasing which latest innovations and …

IEEE International Conference on PHYSICAL ASSURANCE and INSPECTION of ELECTRONICS (PAINE)

Huntsville Marriott at the Space & Rocket Center 5 Tranquility Base, Huntsville, AL, United States

About PAINE Physical inspection of electronics has grown significantly over the past decade and is becoming a major focus for the chip designers, original equipment manufacturers, and system developers. The complex long life of the electronic devices coupled with their diverse applications is making them increasingly vulnerable to various forms of threats and inspection. Large …

SEMICON Europa 2024

Messe Munchen Munich, Germany

SEMICON Europa 2024 is co-located with electronica and will take place in November 12-15, 2024 in Munich, Germany. This year’s theme Innovation and Collaboration: Powering Sustainable Exponential Growth expresses SEMICON Europa support to the European semiconductor ecosystem, highlighting the important role in driving sustainable exponential growth through innovation and strategic collaborations. Only by fostering collaborative efforts, the …

Advanced Design & Manufacturing Montréal 2024

Palais des congrès de Montréal 1001 Place Jean-Paul-Riopelle, Montréal, Québec, Canada

Montréal's End-to-End Design and Manufacturing Show Returns Advanced Design & Manufacturing Montréal brings together five advanced manufacturing areas — Design & Manufacturing, Automation Technology Expo, PACK EX, EXPOPLAST, and Powder & Bulk Solids. This all-in-one, industry-wide event lets you explore the latest trends and technologies shaping the future in advanced design and manufacturing across automation, …

TSMC Open Innovation Platform® Ecosystem Forum 2024 – China

Hyatt Regency Beijing Wangjing 8 Guangshun South Street, Beijing, China

The TSMC Open Innovation Platform® Ecosystem Forum is a unique event that brings together the semiconductor design community and TSMC customers. The OIP Forum will feature multi-track technical presentation sessions along with an Ecosystem Pavilion. The Forum provides an ideal venue to build relationships with TSMC customers. We have set the dates for our 2024 global …

Advanced Packaging Conference (APC) 2024

Messe Munchen Munich, Germany

Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency Innovation and Collaboration: New types of Neural Networks (Large Language Models), such as ChatGPT and other text generator, as well as Artificial Intelligence (AI) applications of different kind, are pushing the demands for High Performance Computing (HPC) to new levels. Chiplets, Heat Dissipation, Miniaturization, …