The Design & Verification Conference & Exhibition is the premier conference on the application of languages, tools, methodologies, and standards for the design and verification of electronic systems and integrated …
About GlobalFoundries Technology Summit (GTS) GF Technology Summit (GTS) 2024 is our worldwide, annual series of technology-focused events. GTS brings together leaders from across the semiconductor industry to share their insights on the latest technology trends that enable us to design the essential chips the world relies on to live, work, and connect. GTS 2024 Highlights This …
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Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's microprocessor chips have one thousand times the processing power of those a decade ago. These …
On behalf of the Local Organising Committee and the International Scientific Committee we are pleased to be hosting the next iteration of the successful conference series in Edinburgh. Edinburgh Skyline from Calton Hill on …
The Premier Microelectronics Event This year, SEMICON Taiwan has achieved a record scale with more than 1,000 exhibitors across 3,600 booths. Themed 'Breaking Limits: Powering the AI Era', the event …
Join us in this webinar to learn about the new features available in Ansys Fluent in 2024 R2. Time: September 3, 2024 11am EST Venue: Virtual What attendees will learn …
Check out the latest updates to Ansys Fluent GPU Solver in 2024 R2, including additional hardware support, new physics, and simulation environment improvements in this upcoming webinar. TIME: September 4, …
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Introducing Ansys Access on Microsoft Azure, a newly released option that streamlines your transition to the cloud. This solution allows a hybrid approach, enabling you to offload heavy workloads to …
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Ansys introduces Ansys TwinAI, a new addition to Ansys Digital Twin's product portfolio that seamlessly integrates the accuracy of physics models with insights from real-world data powered by cutting-edge AI/ML …
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Join this webinar for the latest updates on virtual engineering simulation capabilities in the primary and secondary packaging domain. Showcasing physics-based 3D simulation for performance insight during storage, transportation, and …
Power-Efficient RISC-V, DSP and NPU IP for Your Diverse SoC Processing Needs As electronic systems continue to become more complex and integrate greater functionality, SoC developers are faced with the …
We are holding a FREE virtual workshop course for automotive OEM, suppliers and semiconductor industry professionals who want to better understand the software solutions available to help them comply with …
Continue reading "Webinar: ISO26262 FuSa Software Hands-On Workshop for Automotive Value Chain"
