Abstract: A successful multi-die design begins at the architecture exploration level. However, the architecture challenges are exacerbated for multi-die designs as performance and power need to be optimized across multiple …
Join Ansys Optics Manager of Product Management, Tom Pickering, and Senior Manager of Optical Assemblies and Technology, Katie Schwertz, for a comprehensive webinar on the design process for optical assemblies, …
About The European Microwave Association (EuMA) is an international non-profit association with a scientific, educational and technical purpose. The aim of the Association is to develop in an interdisciplinary way, education, training and research activities, including: Promoting European microwaves Networking and uniting microwave scientists and engineers in Europe Providing a single voice for European microwave …
Failure and Yield Analysis is an increasingly difficult and complex process. Today, engineers are required to locate defects on complex integrated circuits. In many ways, this is akin to locating a needle in a haystack, where the needles get smaller and the haystack gets bigger every year. Engineers are required to understand a variety of …
ECOC Exhibition 2024 travels to Frankfurt in Germany. Meet with more than 300 companies and over 6000 colleagues, peers and contacts over the three days. Find out what you can expect at ECOC Exhibition 2024 and read the highlights from the 2023 event which took place in Glasgow in October MARKET FOCUS Now in it’s …
Join us for a 2-day deep dive into the expanding world of Digital Twin (DT) technology in the semiconductor realm. Understand its potential challenges and opportunities and discover its transformative power in enhancing operational productivity and quality. Calling all DT developers and end-users: collaborate, learn, and pave the way for DT's integration into manufacturing! SEMICONDUCTOR …
We will discuss the findings of a joint survey conducted by Hyperion Research, Intel, and Ansys on Total Cost of Ownership (TCO) models utilized for both on-premises and cloud-based HPC …
Continue reading "Webinar: Total Cost of Ownership of HPC and AI for Engineering"
Primarius NanoSpice™ Series boosts SRAM design accuracy and performance with its powerful suite of tools. Featuring competitive performance, a circuit-type-driven intuitive usage model, and comprehensive capabilities. These solutions deliver high-precision …
September 17 and 24, 2024, 15:00 - 16:00 (CEST) | Join the webinar live or watch it later on demand Join our engaging webinar series on blue GIS technology, tailored …
Continue reading "Webinar: Powering sustainable and reliable energy distribution with blue GIS"
In this webinar, we'll showcase how advanced engineering analytics and materials intelligence can optimize your design processes for sustainability. Discover how to enhance product development by reducing environmental impacts and …
WELCOME TO SISPAD2024 The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of leading-edge research and development in the area of …
Join us for an informative webinar on Simulation Process and Data Management (SPDM), to learn how Ansys Minerva effectively manages simulation parameters and standardizes use amongst the simulation users within …
