IEEE/EPS Hybrid Bonding Symposium

SEMI World Headquarters 673 South Milpitas Blvd, Milpitas, CA, United States

Hybrid Bonding has emerged as the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the …

Chiplet Summit 2025

Santa Clara Convention Center 5001 Great America Pkwy, Santa Clara, CA, United States

Chiplet Summit Is the #1 Place to Exhibit Position Your Company as a Leader in an Emerging Technology.  Lay Claim to Your Share of a Projected $5.8 Billion Market (Omdia).  Share Thoughts with Key Experts and Analysts.  Show Movers and Shakers How Your Products and Roadmap Will Drive the Industry. Meet Highly Motivated Customer Prospects. …

SPIE Photonics West 2025

The Moscone Center The Moscone Center, San Jose, CA, United States

Browse the 2025 program; discover all the ways you'll connect with colleagues Join the world’s largest photonics technologies event. Learn the most cutting-edge research in biomedical optics, biophotonics, industrial lasers, optoelectronics, microfabrication, displays, quantum technologies, and more. Review the lineup of outstanding plenary speakers from around the globe. Select advanced training from more than 50 …

DesignCon 2025

Santa Clara Convention Center 5001 Great America Pkwy, Santa Clara, CA, United States

The Must Attend Event for Chip, Board, and Systems Design Engineers DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley. The Conference – A Systematic Approach to Learning & Discovery Attend the expertly curated 14-track conference created by engineers …

Semiconductor Technology Overview

Phoenix, AZ Phoenix, AZ, United States

Semiconductor and integrated circuit development continues to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today's wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Semiconductor Technology …

Product Qualification Overview

Phoenix, AZ Phoenix, AZ, United States

Package reliability and qualification continue to evolve with the electronics industry. New electronics applications require new approaches to reliability and qualification. In the past, reliability meant discovering, characterizing and modeling failure mechanisms, and determining their impact on the reliability of the circuit. Today, reliability can also involve tradeoffs between performance and reliability; assessing the impact …

IC Packaging Technology

Phoenix, AZ Phoenix, AZ, United States

Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and the system level interconnection; 2) chemical, environmental and mechanical protection; 3) heat transfer; 4) power, ground and signal distribution between the die and system; 5) …

2025 IEEE International Solid-State Circuits Conference (ISSCC)

San Francisco Marriott Marquis 780 Mission Street, San Francisco, CA, United States

About ISSCC The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and systems-on-a-chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts. REGISTER HERE

SMTA Wafer-Level Packaging Symposium

Hyatt Regency San Francisco Airport 1333 Bayshore Highway, Burlingame, CA, United States

Thank you to those who attended and participated in the 2024 SMTA Wafer-Level Packaging Symposium! Their presence contributed to the success of this event, and we are truly thankful for their active engagement throughout the symposium! The WLPS showcased a rich and diverse technical program, featuring cutting-edge presentations and discussions on semiconductor and packaging technologies. …

Advanced CMOS/FinFET Fabrication

Phoenix, AZ Phoenix, AZ, United States

Semiconductor and integrated circuit developments continue to proceed at an incredible pace. For example, today's microprocessor chips have one thousand times the processing power of those a decade ago. These challenges have been accomplished because of the integrated circuit industry's ability to track something known as Moore's Law. Moore's Law states that an integrated circuit's …

SEMICON Korea

Beginning with 189 booths in 1987, SEMICON Korea has established itself as an exhibition representing the semiconductor industry thanks to the continuous growth of the Korean semiconductor industry. SEMICON Korea 2025 is scheduled to be held from February 19 to February 21, 2025. This exhibition will showcase the latest semiconductor materials, equipment, and related technologies. With …

SPIE Advanced Lithography + Patterning

San Jose McEnery Convention Center 150 W San Carlos St, San Jose, CA, United States

Attend to hear research, challenges, and breakthroughs as you gather with colleagues in San Jose Join other leading researchers who are solving challenges in optical and EUV lithography, patterning technologies, metrology, and process integration for semiconductor manufacturing and adjacent applications. REGISTER HERE