You are currently viewing SemiWiki as a guest which gives you limited access to the site. To view blog comments and experience other SemiWiki features you must be a registered member. Registration is fast, simple, and absolutely free so please, join our community today!
Meetings commence at 12:30pm on the Monday, starting with lunch. Young Engineer Sponsorship: The ARMMS RF & Microwave Society provides sponsorship for young engineers (28 or below) who have had papers accepted for presentation at each meeting. Sponsorship is £200 cash plus free attendance (including conference dinner and overnight accommodation). Potential candidates should identify themselves …
Whether you're involved in producing, distributing, or maintaining thermal management solutions, Thermal Management Expo is designed for you. Harness the potential of cutting-edge materials and technologies to enhance your application capabilities, guaranteeing optimal performance and longevity. Identify the latest mechanical engineering solutions, concepts, and opportunities Meet hundreds of potential supply chain partners, showcasing the latest technologies, innovations …
Combining Ansys Gateway powered by AWS, Ansys, and AWS startup programs, companies can take advantage of more computing when they need it without substantial upfront investments with the pay-as-you-go flexibility that the cloud provides. Sign up for this webinar today. TIME: APRIL 30, 2024 11 AM EDT / 5 PM CEST / 8:30 PM IST …
(Work email required for verified registration) During a project, subsystem and full-chip integration plays a crucial role. Integration can be particularly challenging on large SoCs with distributed teams due to complexity of the integration process, multi-site infrastructure issues, as well as the need to collaborate across multiple time zones. Often, integrators must integrate design blocks …
Discover the new features of Ansys Digital Twin in our latest release, Ansys 2024 R1, extending its digital twin offering. Digital Twins deployment and Hybrid Analytics include new optimization algorithms for parameter calibration and streamlined fusion workflows. TIME: APRIL 30, 2024 3 PM IST Venue: Virtual Overview Ansys launched Ansys 2024 R1, which extends its …
The 2024 UK Innovation Conference Building on the success of the 2023 edition, this year's event is set to be bigger and better than ever. With industry-leading keynote speakers, top plenary sessions, increased networking opportunities, and industry and application tracked sessions, join us to uncover what's possible through simulation. Gain insight into Ansys' simulation strategy …
REGISTER: https://us02web.zoom.us/webinar/register/5517125835521/WN_ZCmAh5TcRYeo7EWd4sM6vA AMD Versal AI Engine Tool Flow Explained: Enhancing Your Development Journey In this webinar, learn how to get started programming the Versal AI Engines using the Vitis IDE. This session provides a thorough introduction to the Vitis IDE for AIE development, and how to use the AI Engine Simulators to quickly develop and …
STAC Summits bring together CTOs and other industry leaders responsible for solution architecture, infrastructure engineering, application development, machine learning/deep learning engineering, data engineering, and operational intelligence to discuss important technical challenges in trading and investment. Theme: GenAI in production A number of financial firms stood up LLM POCs in 2023 and have now moved them …
Existing diagnostic and treatment methods for pulmonary diseases face challenges. Artificial Intelligence (AI) algorithms present novel opportunities for enhancing diagnostic accuracy and personalizing treatment plans. Learn how the CFD approach can improve diagnostic accuracy in this upcoming webinar. TIME: MAY 2, 2024 11 AM EDT / 5 PM CEST / 8:30 PM IST Venue: Virtual …
Electronics that are exposed to fluctuating temperatures undergo a process known as thermal cycling. These fluctuations in temperature cause the PCB and it’s components to expand and contract with the rise and fall of temperature. The various materials used electronics will expand and contract at different rates due to a mismatch in the coefficient of …
Combining market-leading design-for-test (DFT) technologies with best-in-class netlist synthesis allows you to achieve DFT success more quickly. Many customers, including those for emulation and IC test, have challenges with scaling architectures. This webinar describes how Siemens emulation and silicon test solutions can work together to provide a smart DFT plug-and-play architecture for Veloce ICs. The …
Join this webinar to meet Cadence’s comprehensive digital twin solution that facilitates sustainable data center design and modernization, marking a significant leap forward in optimizing data center efficiency and operational capacity. See why industry leaders are praising the ground-breaking Cadence Reality Digital Twin Platform for accelerating the development of next-generation energy-efficient data centers and optimizing …
As AI is redefining communication and connectivity, your ability to design, simulate, and test — using an intelligent and automated workflow — is what will set you apart. Join us for a half-day event that brings together top industry experts and innovators to explore modern RF circuit and system design, including advanced topics like phased …
About this event Join Keysight for a comprehensive overview of the latest developments in wireless communications testing from 5G deployments to 6G research. Local Keysight experts will be in attendance to demonstrate the latest in Keysight's 5G and RF solutions. REGISTER HERE
An Invitation to Diverse Universe: CUG 2024 Dear Cray User Group colleagues, Australia’s Pawsey Supercomputing Research Centre and the CUG Board would like to invite you to the 2024 CUG Conference in Perth, Western Australia, on May 5-9, 2024. The theme for the 2024 event is Diverse Universe, highlighting our commitment to supporting diverse scientific workloads and services including …
About HOST IEEE International Symposium on Hardware Oriented Security and Trust (HOST) is the premier symposium that facilitates the rapid growth of hardware-based security research and development. Since 2008, HOST has served as the globally recognized event for researchers and practitioners to advance knowledge and technologies related to hardware security and assurance. Rapid proliferation of computing …
Don't Miss Out! Register for RSAC 2024—The Art of Possible In an ever-changing cybersecurity world, innovation and creativity are key. Join RSAC 2024 and discover The Art of Possible as we collectively create works that will change our perspective on what we can accomplish. Let's celebrate limitless opportunities, challenge the status quo, and explore new horizons together. …
The major annual event of the Israeli semiconductor industry ChipEx2024, the largest annual event of the Israeli semiconductor industry, will be held on May 7-8, 2024 in Tel Aviv, Israel. ChipEx2024 showcases companies including manufacturers, developers and suppliers of advanced hardware technologies & services. It also includes a technical seminar where the world's leading experts address the industry's most relevant …
About Israel Trade and Economic Commission in Sydney, Australia The Israel Trade and Economic Commission is headquartered in Sydney, Australia. Our office is the commercial and investment arm of the Embassy of Israel in Australia, part of the Foreign Trade Administration, under the Israeli Ministry of Economy and Industry. Our office goal is to promote, …
Join us for a 4-day in-person introductory training on four comprehensive simulation solutions. Ansys Materials Ansys Icepak Ansys Lumerical Ansys HFSS Register to attend one or all four sessions. Space is limited, so sign up today to save your spot. *Lunch will be provided for each session. Date: Tuesday, May 7, 2024 – Friday, May 10, …
Time and time again, multidisciplinary research is touted as essential to innovation. That is why, from April 22-26, 2024, researchers working in seemingly unrelated fields will gather in Seattle, Washington to promote, share and discuss issues and developments across disciplines at the 2024 MRS Spring Meeting & Exhibit. The virtual portion of the Meeting is May 7-9, …
Ansys Speos is collaborating with DXOMARK Analyzer, a leading tool for image quality analysis, to revolutionize the validation process of virtual camera systems. This webinar introduces the end-to-end camera solution that integrates physical measurements with simulation. Join us to explore this groundbreaking partnership and learn how it can transform how you assess virtual camera system …
Over the past two months, the CHIPS Program Office (CPO) has announced preliminary memorandum of terms (PMTs) with 7 applicants totaling nearly $29 billion as part of the CHIPS and Science Act to revitalize American semiconductor manufacturing. This webinar will discuss the process by which CPO reviews and evaluates applications for funding and the key factors …
Date: Thursday, May 9, 2024 Venue: Easthampstead Park Wokingham Location: Off Peacock Ln, Bracknell, Wokingham RG40 3DF Parking: There is complimentary parking at the venue. When you reach the hotel at the end of estate, turn left and follow the signs to the car park. You will receive further information in your registration confirmation email. Analog, RF, and Mixed-Signal …
Antenna/RF design problems often involve the optimization of many variables, requiring numerous evaluations (EM simulations) using traditional optimization methods. Design engineers need an intelligent, accurate, and easy-to-use simulation platform and analysis solution that reduces repetitive design cycles while increasing user productivity and efficiency. Leveraging an advanced AI-enabled methodology, Optimality Explorer delivers quality results leading to …
In partnership with the U.S. Department of Labor’s Office of Disability Employment Policy and The Good Jobs Initiative, CHIPS for America will host this webinar for organizations that serve, support, or otherwise work with the disability community. This will serve as a CHIPS for America program primer and will focus on CHIPS workforce development requirements …
Registration is now open for the annual CEO Executive Outlook co-hosted by the ESD Alliance, a SEMI Technology Community, and Keysight Technologies. It will be held Thursday, May 9, in Santa Clara, Calif., and features two high-profile executives –– Calista Redmond, CEO of RISC-V International, and Patrick Little, CEO of SiFive, a RISC-V IP provider. …
ISC High Performance 2024 connects public and industry users and technology developers in Hamburg, Germany, from May 12 – 16. As Moore's Law slows down and semiconductor fabrication costs rise, high performance computing (HPC) is at a critical juncture. Cloud hyperscalers are increasingly dominating computing economics by utilizing custom semiconductors. Meanwhile, AI advancements are transforming …
The Radar Future Conference is an industry event initiated by the China Radar Industry Association. It aims to bring together authoritative experts from government, industry, academia, research, application, and capital in the field of radar and electronic information engineering and related user industries to jointly explore and promote radar and related The expanded application of …
The 16th IEEE International Memory Workshop (IEEE IMW) will be held in 2024 in Seoul. It is currently planned as an on-site event. This conference brings the memory community together in a workshop environment to discuss the memory process and design technologies, applications, market needs and strategies. It is sponsored by the IEEE Electron Devices …
ASMC brings together manufacturers, equipment and materials suppliers, and academia to solve manufacturing challenges with innovative strategies and methodologies. Advancing Semiconductor Manufacturing Excellence ASMC is the leading international technical conference for discussing solutions that improve the collective manufacturing expertise of the semiconductor industry. Solving the challenges presented by semiconductor manufacturing is a combined effort by …
Our workshop will feature content including, but not limited to, the following areas: Artificial Intelligence & Machine Learning (AI / ML) Continuing Education & Workforce Development Designing with Field Programmable Gate Arrays (FPGAs) / Systems on a Chip (SoCs) / New Devices FPGA & SoC Assurance Guidelines and Standards On-Orbit Experiments & Model Validation Radiation …
Join our community of thinkers and doers in design, manufacturing, and lifecycle management to accelerate your digital transformation. Session selection is open Explore the Realize LIVE Americas session catalog, featuring more than 200 diverse sessions across multiple industries. Gain insights into digital transformation with key discussions on the industrial metaverse, cloud and SaaS, sustainability, artificial …
Join Ansys at VECS 2024, where you will meet the most innovative minds in Autonomous, Electrification, Connected Vehicles & Mobility. Don't miss the keynote “From Racetrack to Road - How Learnings from Formula E Benefit Electrification at Porsche,” by our special guest speaker from Porsche Motorsport. You will get in-depth insights, new disruptive knowledge, and …
Why Attend? Benefiting you, your company and the industry Being the world’s largest gathering of senior executives in semiconductor manufacturing, we can offer you many exclusive benefits. Global Network Meet government officials and senior semiconductor manufacturers from around the world who are seeking new solutions. Expand Business Identify opportunities to partner in markets where budget …
POWERING INNOVATION THAT DRIVES HUMAN ADVANCEMENT Having the right solution at the right time can mean the difference between tabling thoughts or transforming industries. Ansys technologies put the power of innovation in your hands. Join us for a free, virtual, global simulation event that is designed to inspire, equip and empower you to innovate. EXPERIENCE …
THE LARGEST EVENT IN THE BANKING SECTOR IN SPAIN What will you find The annual meeting point for leaders and entities in the banking sector, focused on exploring disruptive trends such as AI and blockchain. The event that drives innovation and strategic collaboration, redefining the future of banking. REGISTER HERE
In the ever-growing race to optimize manufacturing operations, the ability to monitor and control processes in a timely manner is essential to minimize material wastage and maximize overall equipment effectiveness. In this webinar, you will see how digital twins foster intelligent operations and improve processes by: Enabling accurate monitoring through key performance indicators (KPIs) based …
Join this webinar to learn about the latest updates of the PyAnsys package PyTwin, which gives easy access to the power of Ansys Digital Twins Runtimes through Python. The webinar will detail PyTwin and the APIs for users to implement their Python applications. TIME: MAY 14, 2024 SESSION 1: 5:30 AM EDT / 11:30 AM …
Date: Tuesday, May 14, 2024 Venue: Hilton Dresden Location: An der Frauenkirche 5, 01067 Dresden, Germany Parking: There is parking at the hotel with a charge of €28 per day. You will receive further information in your registration confirmation email. Analog, RF, and Mixed-Signal IC Design Learn how the latest developments within Virtuoso Studio and Spectre platforms can significantly …
If your job is all about finding the Next Big Thing, you won’t want to miss the next Semiconductor Deep Tech Day on Tuesday April 25, 2023, from 12 p.m. to 5:30 p.m. at Plug and Play Tech Center - 440 North Wolfe Road – Sunnyvale, CA 94085 – United States See some of the …
Sustainable High City Tech for a future Fostering open innovation with startups from Tokyo to the world Asia's largest and Japan's only global innovation conference that creates "new encounters" with both domestic and international startup ecosystems to solve the common global urban issues. The event will feature thought-provoking Sessions by industry leaders from Japan and around …
In a rapidly changing world, it’s either disrupt, or be disrupted. The convergence of global unrest, rising NatCat losses and evolving customer needs are threatening profitability across the board. But with pressure, comes progress. Set your future roadmap at Reuters Events: The Future of Insurance USA 2024 (May 15-16, Chicago), this year merging with Insurance AI & Innovative …
The Next Step in Growing Your Manufacturing Business. Western Canada's premier platform to explore ideas and opportunities that fuel smart manufacturing adoption and innovation. Specifically tailored to Western Canadian small and mid-sized manufacturing companies, this exciting exhibition will feature: 40,000+ square feet of exhibitions to meet with vendors and learn about exciting new technology. Keynotes …
Presentations from the 2023 Qualcomm Product Security Summit A dark side of UEFI: the same classes of vulnerabilities can affect multiple silicon ecosystems - Alex Matrosov Incident response at Qualcomm: Deriving value from the fires - Scott Bauer The Current and Future of Post-Quantum Cryptography - Reza Azarderakhsh Shooting Cryptographic Fish in a Barrel - Nadia Heninger SyzDescribe: …
Join us on May 15 for the SimWorld East Innovation Conference! This exclusive evening event will be a dynamic blend of insights and networking opportunities. We're thrilled to kick off with a presentation from our esteemed Brig Gen (Ret) Steve Bleymaier, CTO for Aerospace & Defense at Ansys. Following the presentation, we'll delve deeper into the Aerospace & …
REDUCE THE RISK AND COST OF LATE DESIGN, MANUFACTURING CHANGES How to Shorten Development Time and Reduce Costs for Your Next Product If your team utilizes Altair® InspireTM, SimSolid®, and SimLab® in the early stages of product development to improve product performance, or manufacturing simulation like Altair® InspireTM Cast, Altair® InspireTM Form to bring your concepts to …
2024 Speakers: Doug Smith and Ken Wyatt Doug Smith Topics: Resonant Structures in PCBs and Systems (Smith) Resonances in electronic systems are responsible for both EMC related failures and system operation problems. We will cover resonances both at the system level, such as PCB to enclosure/chassis resonances, as well as cable, heat sink, enclosure, and unwanted …
The evolving landscapes of satellite communications, wireless, and millimeter-wave communications are drivers for innovative technology developments leading to the demand for more bandwidth. This complimentary event includes dynamic discussions, live product demonstrations, and presentations on the latest applications. You will learn about: Theory of operation and solutions for phase noise measurements Optimizing EVM Mastering noise …
Date: Thursday, May 16, 2024 Venue: Holiday Inn Munich - City Centre Location: Hochstrasse 3, Munich, 81669 Germany Parking: On-site parking for €20 per day. You will receive further information in your registration confirmation email. Analog, RF, and Mixed-Signal IC Design Learn how the latest developments within Virtuoso Studio and Spectre platforms can significantly improve your design productivity and make …
The adoption of wide-bandgap power MOSFETs (SiC and GaN) is growing in power electronic applications for consumer electronics, automotive, and renewable energy. Successful implementation of simulation in system design requires high-fidelity, numerically robust, and compact power MOSFET models. The Saber circuit simulation environment offers a proven and mature solution with a dedicated tool that allows …
As AI is redefining communication and connectivity, your ability to design, simulate, and test — using an intelligent and automated workflow — is what will set you apart. Join us for a half-day event that brings together top industry experts and innovators to explore modern RF circuit and system design, including advanced topics like phased …
IR drop closure is becoming a major challenge for designers on advanced nodes. The number of violations at signoff has increased significantly, leading to longer turnaround time (TAT) or violations being waived. To solve this challenge, IR drop needs to be addressed early in the implementation phase with an automated IR prevention and fixing methodology. …
Symposium Overview The International Applied Computational Electromagnetics Society (ACES) Symposium serves as a forum for developers, analysts, and users of computational techniques applied to electromagnetic field problems for all frequency ranges. The symposium includes technical invited plenary and regular presentations, software tutorials, vendor booths, and short courses. Papers may address general issues in applied computational electromagnetics …
The IEEE European Test Symposium (ETS) is Europe’s premier forum dedicated to presenting and discussing scientific results, emerging ideas, applications, hot topics and new trends in the area of electronic-based circuits and system testing. In 2024 ETS will take place in Marriott hotel, Den Haag, the Netherlands. It is organized by the Delft University of Technology. …
SAWE President's Message Robert Hundl - SAWE International President On behalf of the Society of Allied Weight Engineers I want to extend a cordial invitation to our 83rd Annual International Conference being held virtually for the 3rd time. Our conference planning committee is putting together a great line up of topics and papers for you: …
Join over 3,000 senior executives at the biggest conference on marketing, CX, data analytics, AI, and digital growth strategies in the banking world! The Financial Brand Forum is the fastest growing and most prestigious annual conference in banking. 1 out of every 11 retail banking institutions in the U.S. attend the Forum Two out of every three attendees …
The Summit attracts a global audience of technology professionals from companies developing computer vision and edge AI-enabled products including embedded systems, cloud solutions and mobile applications. Why attend? It's a First-Rate Program with Powerful Insights into Practical Perceptual AI. Join us for four days of learning—from tutorials to deep-dive days, covering the latest technical insights, …
Generating Value Together: From Data to AI to Collective Intelligence Welcome to the era of collective intelligence. Now is the time to mobilize the synergy of human expertise, data, analytics and AI to optimize business value and outcomes by making the best connected decisions. Fundamentals matter. We are always building and updating our technology, data …
DISRUPTIVE TECHNOLOGIES FOR INDUSTRY CHALLENGES Industry IoT · Artificial Intelligence · Renewable Energy · Cloud Computing · Cybersecurity · Big Data · Augmented Reality · Robotic Process Automation · 5G Technologies · Edge Computing · Digital Twin The global leading event Discover the ultimate tech-powered revolution at the IOT Solutions World Congress, the unrivaled event …
Today’s global reality is marked by geopolitical tensions, volatile markets, and climate change. Tackling these challenges is becoming increasingly complex, as each solution requires disruptive innovations in chip technology. Imec’s expertise has driven progress in the global semiconductor industry for 40 years now – an anniversary which we’ll celebrate at ITF World and throughout the year 2024. Yet, it …
We're back in Detroit, bringing together experts from across the industry We’re bringing AutoSens back to Huntington Place, Detroit on the 21-24th May 2024, to meet and shape the future of automotive technology. AutoSens is a unique opportunity that unites OEM, Tier 1 and supply chain engineers involved in automotive sensing technology. Coming together as …
Celebrating 25 Years of Digital Innovation Established in 1999, the UK Altair Technology Conference (ATC) has become the preeminent, industry-wide event for showcasing digital design innovation in the UK. Renowned for its thought-provoking keynote addresses and technical presentations, the conference highlights cutting-edge digital advancements throughout industry. Returning for its 13th iteration, the biennial UK ATC …
Date: Tuesday, May 21, 2024 Venue: H2C Hotel Milanofiori Location: Via Roggia Bartolomea, 5, 20057 Assago MI, Italy Parking: There is a car park on-site that is free of charge. Spaces cannot be guaranteed as it is used by all hotel guests. You will receive further information in your registration confirmation email. Analog, RF, and Mixed-Signal IC Design Learn …
In recent years, the semiconductor industry has experienced a breakthrough in the onset of 2.5D and 3D chiplet-based products. These products promise to extend the limits of Moore’s Law while demolishing limitations on speed and capacity for our highest tiers of compute. But for all the adulation we heap upon the 3DIC paradigm, we seemingly …
WHERE INNOVATION MEETS INFRASTRUCTURE Experience the world's largest gathering of data centre professionals and end-users at Data Centre World Frankfurt on 22-23 May 2024 at Messe Frankfurt. Data centres are the beating heart of the digital economy. Now it's time to take part in the event that powers the digital economy. Why Attend Data Centre World Frankfurt invites …
ASIP Designer enables the creation of custom vector DSPs for AI Wednesday, May 22, 2024 4:00 - 6:00 pm CEST / 7:00 - 9:00 am PT Case Studies accelerating AI applications using custom RISC-V based SIMD/VLIW DSPs The revolution in AI triggers an increased awareness for application-specific instruction-set processors (ASIPs). These processors implement a specialized …
Ever wondered how light travels within a device? This Rand Simulation webinar will be your guide to understanding and designing optical lightguides using Ansys SPEOS. We'll explain the fundamentals of SPEOS and explore its capabilities for simulating light behavior in lightguides. Join us on Wednesday, May 22 at 2 PM ET and discover how we …
EXPLORING OPEN COLLABORATION, INNOVATION & ENERGY TRANSITION Norris Conference Center, Houston, TX, USA | 23 May 2024 Future Digital Twin & Generative AI will explore Open Collaboration, Innovation and Energy Transition. Expert speakers will present and discuss Generative AI, Reality Capture and Digital Twins; Digital Twin and Large Language Models (LLM’s); Integrated Value Chains, Decarbonisation and Digital …
Ansys Semiconductor Manufacturing Webinar Series: Part 2 of 3. Join us on Thursday, May 23rd for an in-depth discussion on reducing defects in the semiconductor packaging process. Learn more about the webinar series! TIME: THURSDAY, MAY 23, 2024 11 AM EASTERN TIME Venue: Virtual Overview Semiconductor packaging involves integrating heterogeneous chips with different functionalities into a …
Be sure to register for this high tech security webinar. You’ll learn how to identify threat scenarios quickly and why a model-based, system-oriented solution is needed to protect your hardware. TIME: MAY 23, 2024 2 P.M. CET (CENTRAL EUROPEAN TIME) Venue: Virtual Overview Connected vehicles offer a range of benefits, such as real-time data sharing, …
Eurocrypt 2024, the 43rd Annual International Conference on the Theory and Applications of Cryptographic Techniques, will take place at Kongresshaus in Zurich, Switzerland on May 26-30, 2024. Eurocrypt 2024 is organized by the International Association for Cryptologic Research (IACR). The affiliated events will take place at ETH Zurich on May 25-26, 2024. REGISTER HERE
Learn from leading hardware security researchers & professionals and discuss the latest & most innovative research on attacking and defending hardware. Connect with industry peers. Join us for a bigger, bolder, and better hardwear.io. ARE YOU READY FOR HARDWEAR.IO USA 2024? In the past couple of months our goal was to knuckle down and build …
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society. The technical program contains papers covering leading edge developments and technical …
Get the latest on: TSMC's industry-leading HPC, smartphone, IoT, and automotive platform solutions TSMC’s advanced technology progress on 5nm, 4nm, 3nm, 2nm processes and beyond TSMC’s specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, sensor technologies, and more TSMC 3DFabric™ advanced packaging technology advancement on InFO, CoWoS®, and TSMC-SoIC® TSMC’s manufacturing excellence, …
Join Ansys on May 30, 2024, at the Brookstreet Hotel in Ottawa for the Ansys Canada Innovation Conference. This one-day event will blend Ansys expert-led technical sessions, highlighting workflows and solutions and engaging customer presentations demonstrating proven results. Date: Thursday, May 30, 2024 Time: 8:00 AM - 3:30 PM EDT Location: The Brookstreet Hotel Ottawa …
Thursday, May 30, 2024 | 10:00-11:00 a.m. PDT Many automotive applications require processing workloads with minimum latency and precise timing budgets. This is especially true for safety-critical applications like adaptive cruise control and anti-lock braking, where human life may be jeopardized. These systems require processing elements that can respond to events within specific (predictable) time …
Since 2016, KnowMade has been researching and monitoring the intellectual property (IP) landscape related to advanced semiconductor packaging, including fan-out WLP, 2.5D packaging, and 3D SoC. Propelled by high-performance computing and emerging applications, a tremendous number of inventions have been published in recent years. While historical players have expanded their patent portfolios, new entrants have …