Webinar: Optimizing NVH Performance with Ansys’ Advanced Solutions

Online

Join us for an in-depth exploration of our advanced NVH (Noise, vibration, and harshness) solutions. This webinar will showcase Ansys's advanced technologies and tools to help engineers tackle complex NVH challenges quickly and precisely. TIME: AUGUST 21, 2024 11:00 AM - 12:00 PM (EDT) Venue: Virtual Overview Join us for an in-depth exploration of our …

Webinar: Simulating Dark Count Rate in Single Photon Avalanche Detectors (SPADs)

Online

Join us as we delve into the simulation of the dark count rate (DCR) in silicon SPADs using Ansys Lumerical CHARGE. Participants will learn about the workflow for simulating the electric field and thermal generation rates, followed by calculating the avalanche triggering probability and DCR. TIME: AUGUST 22, 2024 SESSION 1: 9:00 AM EDT SESSION …

Webinar: Unlock Seamless EDA License Management On-Prem or In the Cloud

Online

Synopsys Webinar | Thursday, August 22, 2024 | 10:00 - 10:40 a.m. PT Join us for an exclusive Synopsys Cloud webinar highlighting the benefits of license management automation. Synopsys Cloud offers hassle-free EDA license management for chip design teams whether EDA tools are run on their own compute farms, in a cloud environment (from any …

SNUG Singapore

ParkRoyal on Beach Road 7500 Beach Rd, Singapore

Connecting the Synopsys User Community Since 1991, the Synopsys Users Group (SNUG) has represented a global design community focused on innovating from Silicon to Systems. Today, as the electronics industry’s …

Hot Chips 2024

Stanford University 450 Jane Stanford Way, Stanford, CA, United States

Hot Chips 2024 will be held as a hybrid conference with in-person attendance at Memorial Auditorium, Stanford University from August 25 to 27, 2024. Conference Format Hot Chips 2024 is …

Webinar: IC Packaging Technology

Online

Integrated Circuit packaging has always been integral to IC performance and functionality. An IC package serves many purposes: 1) pitch conversion between the fine features of the IC die and the system level interconnection; 2) chemical, environmental and mechanical protection; 3) heat transfer; 4) power, ground and signal distribution between the die and system; 5) …

IOTE Expo China 2024

Shenzhen World Exhibiton & Convention Center 福海街道展城路1号 邮政编码, Shenzhen, Guangdong Province, China

Description The expo has expanded since 2009, over the past 12 years. Its influence is widespread. In 2019, the event attracted 450 exhibitors and over 50,000 visitors. Visitors from 20 …

Webinar: Smart Product Innovation Just Got Easier

Online

Join us and discover how Autodesk Fusion and Ansys are transforming how consumer products are designed, putting you at the forefront of innovation and giving your creations the competitive edge they deserve. TIME: August 28, 2024 12 PM EDT / 9 AM PT Venue: Virtual Overview Imagine designing the next generation of consumer electronics, smart …

DVCon Japan 2024

Shinagawa, Tokyo, Japan Shinagawa, Tokyo, Japan

The Design & Verification Conference & Exhibition is the premier conference on the application of languages, tools, methodologies, and standards for the design and verification of electronic systems and integrated …